Zobrazeno 1 - 10
of 30
pro vyhledávání: '"In-sung Joe"'
Autor:
Sungbong Park, ChangKyu Lee, Sangcheon Park, Haeyong Park, Taeheon Lee, Dami Park, Minsung Heo, Inyong Park, Hyunyoung Yeo, Youna Lee, Juhee Lee, Beomsuk Lee, Dong-Chul Lee, Jinyoung Kim, Bokwon Kim, Jinsun Pyo, Shili Quan, Sungyong You, Inho Ro, Sungsoo Choi, Sung-In Kim, In-Sung Joe, Jongeun Park, Chang-Hyo Koo, Jae-Ho Kim, Chong Kwang Chang, Taehee Kim, JinGyun Kim, Jamie Lee, Hyunchul Kim, Chang-rok Moon, Hyoung-Sub Kim
Publikováno v:
2022 IEEE International Solid- State Circuits Conference (ISSCC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::81681717842cd7f7c6311481b14850c6
https://doi.org/10.1109/isscc42614.2022.9731750
https://doi.org/10.1109/isscc42614.2022.9731750
Publikováno v:
Cogent Social Sciences; Jan-Dec2023, Vol. 9 Issue 1, p1-18, 18p
Autor:
Jin-Hyung Kim, Chang-Rok Moon, Kijoong Yoon, Minsung Heo, Jaehak Lee, I.S. Park, Minhwan Jeon, Jung-Chak Ahn, Bum-Suk Kim, Inho Ro, Hyun-Chul Kim, Taek-Soo Jeon, Jong-uk Kim, Yun-Ki Lee, Kwang-Min Lee, Dongyeon Daniel Kang, Yoon Kisang, Hye Yeon Park, Jungho Park, In-sung Joe, Changkyu Lee, Eunyoung Jo, Dami Park, Chanho Park, JaeSung Hur, Hyoungsub Kim, Chong Kwang Chang, Minkwan Kim, Byun Kyung Rae, Seokjin Kwon, Tae-Hoon Kim
Publikováno v:
VLSI Circuits
Sub-micron pixels have been widely adopted in recent CMOS image sensors to implement high resolution cameras in small form factors, i.e. slim mobile-phones. Even with shrinking pixels, customers demand higher image quality, and the pixel performance
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::737be7a6d2c190cf5f9ed199bc4ad138
https://doi.org/10.23919/vlsicircuits52068.2021.9492339
https://doi.org/10.23919/vlsicircuits52068.2021.9492339
Autor:
Chongkwang Chang, In-sung Joe, Chang-Rok Moon, Jong-Eun Park, Jamie Lee, Kwan-Sik Cho, Soo-jin Hong, Hyun-Chul Kim, Im Dongmo, Chung-sam Jun, WooGwan Shim, Beom-Suk Lee, Ho-Kyu Kang, Sungbong Park, Jung-Chak Ahn, Donghyuk Park, Young-ki Hong, Howoo Park, Euiyeol Kim, Tae-Hoon Kim, Jingyun Kim, Dong-Hyun Kim, Taehee Kim, Ho-Chul Ji, Jae-Kyu Lee, Yi-tae Kim, Sung-In Kim, Taehun Lee, Jungho Cha, Changkyu Lee, Haeyong Park, Jin-Young Kim
Publikováno v:
ISSCC
For years, there has been a strong drive for sub-micron pixel development, in spite of reaching the visible light diffraction limit, because a smaller pixel pitch of CMOS image sensors (CISs) is inevitably required for ever-miniaturizing camera modul
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::96dd2184e5c247258fed2d07420e23ea
https://doi.org/10.1109/isscc42613.2021.9365751
https://doi.org/10.1109/isscc42613.2021.9365751
Autor:
Youngsun Oh, Taehun Lee, Dongsuk Cho, Haeyong Park, Joo Hyoung Kim, Han-jin Lim, Hyeongsun Hong, Soo-jin Hong, Changkyu Lee, Yi-tae Kim, Chongkwang Chang, Doo-Won Kwon, Seungjoo Nah, Jung-Chak Ahn, Jingyun Kim, Ho-Kyu Kang, Kyu-Pil Lee, Sangill Jung, Hyun-Chul Kim, In-sung Joe, Jae-Kyu Lee, Jong-Eun Park
Publikováno v:
ISSCC
As the smart mobile device market continues to grow and the number of cameras per device rapidly increases, demand for CMOS image sensors (CIS) also increases. Two major trends in mobile device cameras are: (1) adopting smaller pixels that enable gre
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f551c53edb0eedee8e34a33f48c12cc1
https://doi.org/10.1109/isscc19947.2020.9062924
https://doi.org/10.1109/isscc19947.2020.9062924
Publikováno v:
Transactions of the Korean Society of Mechanical Engineers A. 34:1543-1548
Powder metallurgy processes are used to form Net-Shape products and have been widely used in the production of automobile parts to improve its manufacture productivity. Powder-forging technology is being developed rapidly because of its economic meri
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a98cde1625122be621c6a55d199726c2
https://doi.org/10.3795/ksme-a.2010.34.10.1543
https://doi.org/10.3795/ksme-a.2010.34.10.1543
Publikováno v:
Key Engineering Materials. :963-967
In this paper, a smart skin, i.e. a conformal load-bearing antenna structure, which is a multi-layer sandwich structure composed of carbon/epoxy, glass/epoxy and dielectric material, designs, analyses, fabrications and tests are conducted. Mechanical
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::07e2503c56f03026f2826c6123ba8f43
https://doi.org/10.4028/www.scientific.net/kem.321-323.963
https://doi.org/10.4028/www.scientific.net/kem.321-323.963
Autor:
In-sung Joe, Olav Solgaard
Publikováno v:
IEEE Photonics Technology Letters. 20:508-510
A wavelength-selective optical switch based on waveguide grating routers (WGRs), passive splitters, and combiners is described. Tunable lasers on the transmitter side are the only active switching elements. The WGR is operated on multiple free-spectr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7ee2bc6cbdccfd23a52ee2dcc18fa769
https://doi.org/10.1109/lpt.2008.918237
https://doi.org/10.1109/lpt.2008.918237
Autor:
P. Sunil, Kwan-Sik Cho, Hyunil Byun, G. Y. Jin, Ho-Chul Ji, Seong Gu Kim, Suk-Ho Choi, E. S. Jung, Joong-Han Shin, Amir H. Nejadmalayeri, Jong-Sung Lim, Keun-Yeong Cho, B. J. Kuh, Gitae Jeong, Shinyoung Lee, Dong-Jae Shin, In-sung Joe, Han-mei Choi, Jung-hye Kim, Kyoung-ho Ha, Jin-kwon Bok, Beom-Seok Lee, Yong-hwack Shin, Beom Seok Kim
Publikováno v:
10th International Conference on Group IV Photonics.
The integration of photonic devices with electronic circuit using CMOS-compatible process is presented in this paper. Issues and challenges in the design of process integration are discussed.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3b6dff941a29ef40188d82ec8bef58fc
https://doi.org/10.1109/group4.2013.6644460
https://doi.org/10.1109/group4.2013.6644460
Autor:
Kwang-Hyun Lee, Sung-dong Suh, Seong-Gu Kim, Sang-Hoon Choi, Jinyong Choi, Beom-Seok Lee, Dong-Jae Shin, Jeong-Kyoum Kim, Hong-gu Yoon, Hyukjoon Kwon, Sangdeok Han, Junghyung Pyo, Jeong-Sik Nam, Jung-Hwan Choi, Joo-Sun Choi, Kyoung-won Na, In-sung Joe, Yoon-dong Park, Kyoung-ho Ha, Ho-Cheol Lee, Seok-Hun Hyun, Taejin Jeong, Ho-Chul Ji, Chilhee Chung, Jung-hye Kim, Sunjoong Kim, Ki-Ho Kim, Yong-hwack Shin, Kwan-Sik Cho, Seokyong Hong, Hyunil Byun
Publikováno v:
10th International Conference on Group IV Photonics.
Optical interconnect for a DDR3 DRAM device is verified at a 4:1-serialized 1.6-Gbps data rate using a FPGA-based memory controller board and optical transceiver chips with bulk-Si-based photonic die and electronic die co-packaged.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7087a13bf76ed4a85747ceaae3ebacb0
https://doi.org/10.1109/group4.2013.6644462
https://doi.org/10.1109/group4.2013.6644462