Zobrazeno 1 - 9
of 9
pro vyhledávání: '"In Hak Baick"'
Autor:
Moon Soo Lee, Jinseok Kim, Han-Byul Kang, Hwa-Sung Rhee, Minwoo Lee, In Hak Baick, Miji Lee, Byung-Wook Kim, Sangwoo Pae
Publikováno v:
2019 IEEE International Integrated Reliability Workshop (IIRW).
Molded underfill process provides many benefits over capillary underfill process, but increased void defects in molded underfill process could cause pop-corning effect and solder extrusion during the reflow process. This paper presents a highly effic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::de15bb284b2cb10b2f24ce36c26bbb64
https://doi.org/10.1109/iirw47491.2019.8989917
https://doi.org/10.1109/iirw47491.2019.8989917
Autor:
Ayoung Kim, Seong-Won Jeong, Moon Soo Lee, Sangwoo Pae, Byung-Wook Kim, Jinseok Kim, Han-Byul Kang, In Hak Baick, Sang-chul Shin, Jae-Won Chang, Y. Ji
Publikováno v:
IRPS
This paper investigates the effect of dummy ball on the board level reliability (BLR) by performing thermal cycling (TC) test for 5 wafer level package (WLP) products, each having two or three different dummy ball configurations. Regardless of the di
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fc41edebd27d07b0d40a9bc98d4ef42f
https://doi.org/10.1109/irps.2018.8353653
https://doi.org/10.1109/irps.2018.8353653
Autor:
Min Kim, Moon Soo Lee, Sang Su Ha, Minwoo Lee, Seong Won Jeong, Byung-Wook Kim, In Hak Baick, Sangwoo Pae
Publikováno v:
2017 IEEE International Integrated Reliability Workshop (IIRW).
Epoxy molding compounds (EMC) are commonly applied to mitigate the thermo-mechanical reliability issue associated with the chip-to-package interaction (CPI) of LK/ULK applied flip chip packages. To understand the effect of EMC viscoelastic properties
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::96e510110ab9d913c0aacb766b2ee437
https://doi.org/10.1109/iirw.2017.8361230
https://doi.org/10.1109/iirw.2017.8361230
Publikováno v:
Industrial & Engineering Chemistry Research. 52:17419-17431
Ultrahigh molecular weight bisphenol A polycarbonate (BPAPC) with nonlinear chain structures has been synthesized by solid-state polymerization in microlayers at 230 °C. It has been found that the ...
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4334f770aa0b20befc69d6bc0f115e2c
https://doi.org/10.1021/ie4029544
https://doi.org/10.1021/ie4029544
Publikováno v:
Industrial & Engineering Chemistry Research. 51:16617-16625
An experimental and theoretical modeling study is presented on the kinetics of reversible oligomerization of l-lactic acid and the formation of l-lactide in closed reactors with SnCl2·2H2O/p-toluenesulfonic acid as a binary catalyst mixture. The exp
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7af8e24bd31e500f4352e6b91a871896
https://doi.org/10.1021/ie302853r
https://doi.org/10.1021/ie302853r
Autor:
Eun-Jung Lee, Dong Hwan Lee, Kwang Won Choi, Eunmi Kwon, In Hak Baick, Jongwoo Park, Sangwoo Pae
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Molded Underfill (MUF) process, used in Stacked-Up Package Technology, suffers from void formation that significantly impacts yield and compromises reliability at the product level. However, a concrete methodology, to resolve such issues, remains unc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::897e7fbaeb425f93ce281f00df8893ed
https://doi.org/10.1109/ectc.2016.34
https://doi.org/10.1109/ectc.2016.34
Publikováno v:
Polymer Engineering & Science. 51:1969-1986
The dispersion polymerization of methyl methacrylate (MMA) has been studied in a nonpolar hydrocarbon solvent at low temperature using N,N-dimethylaniline (DMA) and lauroyl peroxide (LPO) as redox initiation system. To explain the heterogeneous kinet
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::15c9c5b0154aeea86dd850f550d81e4e
https://doi.org/10.1002/pen.21971
https://doi.org/10.1002/pen.21971
Autor:
Sangsu Ha, Seungbae Lee, Eunmi Kwon, In Hak Baick, Sangwoo Pae, Jongwoo Park, Seil Kim, Hyun-Suk Chun
Publikováno v:
IRPS
The necessity of the Metal-Insulator-Metal Capacitor (MIMCAP) devices that helps electrical performance of integrated circuit (IC) has drastically increased for high performance mobile SoC applications. We investigate the magnitude of intrinsic stres
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::925439e9503eef93e7b6f7753d963b0d
https://doi.org/10.1109/irps.2015.7112753
https://doi.org/10.1109/irps.2015.7112753
Publikováno v:
Journal of Applied Polymer Science. 132
The structure and properties of ultrahigh molecular weight polycarbonate synthesized by solid-state polymerization in micro-layers (SSPm) are reported. A low molecular weight prepolymer derived from the melt transesterification of bisphenol A and dip
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1ad123a46011c64a3553e774eb70bd47
https://doi.org/10.1002/app.41609
https://doi.org/10.1002/app.41609