Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Imen Chtioui"'
Publikováno v:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
The continuous drive to have smart flexible systems in different application areas as automotive, households, and consumer electronics utilize the development of different integration approaches to include many electronic functionalities in 3D struct
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::58ea69558a625b64421fe86a76b3fbde
https://doi.org/10.1109/estc48849.2020.9229822
https://doi.org/10.1109/estc48849.2020.9229822
Publikováno v:
Microsystem Technologies. 24:831-853
Conventional electronic circuits are made up of electronic components assembled on either rigid substrates like FR4 and ceramic or on flexible substrates based on polymers such as polyimide, PET and PEN foils. The latter type of substrates offers con
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2a4e530e86218ee8af8c4ab029b53ff7
https://doi.org/10.1007/s00542-017-3582-7
https://doi.org/10.1007/s00542-017-3582-7
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 6:533-544
In this paper, we present the developments of a new technology to realize 2.5-/3-D electronic circuits. The starting point is an electronic circuit embedded in a hard thermoplastic material, which is transformed into a 2.5-/3-D shape using a thermofo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::afcd5fe015ad10c0d8f0c38bfb58187b
https://doi.org/10.1109/tcpmt.2015.2511077
https://doi.org/10.1109/tcpmt.2015.2511077
Autor:
Jan Vanfleteren, Sheila Dunphy, Frederick Bossuyt, Imen Chtioui, Bart Plovie, Thomas Vervust, Bjorn Vandecasteele, Yang Yang
Publikováno v:
Procedia Technology. 15:208-215
This contribution describes considerations and very preliminary results in the technology development of thermoplastically deformable electronics and sensor circuits, with the intention to eventually achieve the low-cost fabrication of 2.5D free-form
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::dee76f7ea53ab2763732e70667461db9
Publikováno v:
2016 17th International Conference on Electronic Packaging Technology (ICEPT).
Conformable electronics, electronics that can be integrated into ergonomically or aesthetically 2.5/3D shape surfaces, have received a tremendous attention during recent years. So far, various materials, designs and fabrication methods were developed
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::858fb51f3b8d873b743a67f1abebd9fb
https://doi.org/10.1109/icept.2016.7583384
https://doi.org/10.1109/icept.2016.7583384
Publikováno v:
2016 13th International Conference on Computer Graphics, Imaging and Visualization (CGiV).
Today a need is emerging for embedding electronic and sensor functions in the products which needs these functions, and, importantly, to do this without noticeably influencing the mechanical design of the product. This contribution describes an appro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::563645280458e6c2f627301b20ae04e7
https://doi.org/10.1109/cgiv.2016.14
https://doi.org/10.1109/cgiv.2016.14