Zobrazeno 1 - 10
of 54
pro vyhledávání: '"Ilja Belov"'
Publikováno v:
Archives of Foundry Engineering, Vol vol. 24, Iss No 3, Pp 43-49 (2024)
Accurate kinetic parameters are vital for quantifying the effect of binder decomposition on the complex phenomena occurring during the casting process. Commercial casting simulation tools often use simplified kinetic parameters that do not comprise t
Externí odkaz:
https://doaj.org/article/a58dab04ffc54c528bce235130615875
Publikováno v:
Heat Transfer Engineering. 44:353-367
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e9e2e0bfd219c311933091ab5655eccb
https://doi.org/10.1080/01457632.2022.2059217
https://doi.org/10.1080/01457632.2022.2059217
Publikováno v:
High Temperatures-High Pressures. 51:63-82
For the optimisation of the annealing process of aluminium coils, simulation of the process is often performed. To simulate the process with higher accuracy, reliable input parameters are required, and thermal conductivity (thermal contact conductanc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::40e6ddffbb9384ea98764011033e5d2f
https://doi.org/10.32908/hthp.v51.1107
https://doi.org/10.32908/hthp.v51.1107
Publikováno v:
International Journal of Metalcasting.
This paper describes and validates a methodology for implementation of full-scale sand-casting simulation in a general-purpose finite element software, including mold filling, heat transport, solidification kinetics, chemical microsegregation and pre
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b33d48385beb3791cd603fae2074ac02
https://doi.org/10.1007/s40962-022-00892-9
https://doi.org/10.1007/s40962-022-00892-9
Publikováno v:
Journal of Materials Science. 56:7811-7822
Abstract In order to investigate the influence of the surface-active element on the interfacial phenomena between molten iron and molten Al2O3-CaO-SiO2 slag, a mildly surface-active element, nitrogen, was introduced, and the interfacial phenomena wer
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2a3493aab49888bd22fde53090b0dcec
https://doi.org/10.1007/s10853-020-05730-z
https://doi.org/10.1007/s10853-020-05730-z
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 9:489-501
This paper proposes a novel power module concept specially designed for highly reliable silicon carbide (SiC) power devices for medium- and high-power applications. The concept consists of two clamped structures: 1) a press-pack power stage accommoda
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9889d1b054e20fc747486e02011d562d
https://doi.org/10.1109/tcpmt.2018.2873231
https://doi.org/10.1109/tcpmt.2018.2873231
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 7:1089-1100
This paper presents an experimental methodology for the characterization of thermomechanical displacement and friction properties in a free-floating press-pack structure, and evaluation of the tensile stress on the semiconductor die through simulatio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::55f95edb3a2bf9286aac0cb5660e18ed
https://doi.org/10.1109/tcpmt.2017.2711272
https://doi.org/10.1109/tcpmt.2017.2711272
Autor:
Ralf Poder, Bo Schodt, Peter Leisner, Jang-Kwon Lim, J. Hellen, Mietek Bakowski, Torbjorn M.J. Nilsson, Ilja Belov, Jenny Lang
Publikováno v:
Materials Science Forum. 897:715-718
RF power amplifier demonstrators containing each one GaN-on-SiC, HEMT, CHZ015A-QEG, from UMS in SMD quad-flat no-leads package (QFN) were subjected to thermal cycles (TC) and power cycles (PC) followed by electrical, thermal and structural evaluation
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b7fb388070e299521a42bfcc4f9c1f74
https://doi.org/10.4028/www.scientific.net/msf.897.715
https://doi.org/10.4028/www.scientific.net/msf.897.715
Publikováno v:
2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
Thermo-mechanical deformation, thermal resistance, and lateral temperature distribution were experimentally studied for a high-power AlGaInN LED chip-on-board array at three different input powers. A fullscale CFD model of the LED assembly was develo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2594656bdb504bc18806c76b816dffc9
https://doi.org/10.1109/therminic.2019.8923617
https://doi.org/10.1109/therminic.2019.8923617
Publikováno v:
Materials & Design, Vol 90, Iss, Pp 693-703 (2016)
The paper reveals benefits of multi-disciplinary computer simulation and parametric studies in the design of silver plating process for improved coating distribution. A finite element model of direct current silver plating is experimentally validated
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::333dc52d4542221c872fbce79258df53
http://www.sciencedirect.com/science/article/pii/S0264127515307474
http://www.sciencedirect.com/science/article/pii/S0264127515307474