Zobrazeno 1 - 2
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pro vyhledávání: '"Ikseong Park"'
Autor:
Kwang Seong Choi, Yongtae Kwon, Junwoo Lee, Joungho Kim, Myunghee Sung, Joon-Ki Hong, Namhoon Kim, Ikseong Park, Baekkyu Choi
Publikováno v:
IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565).
As the operating frequency of systems increases above the gigahertz frequency range, the electrical performance of a package becomes more critical. Wafer level package (WLP) is a promising solution for future high-speed packaging needs. Because the l
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9d591427dd57843a4dc036053f99f669
https://doi.org/10.1109/epep.2001.967623
https://doi.org/10.1109/epep.2001.967623
Autor:
Myunghee Sung, Namhoon Kim, Junwoo Lee, Baekkyu Choi, Ikseong Park, Joon-Ki Hong, Yongtae Kwon, Kwang Seong Choi, Joungho Kim
Publikováno v:
IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565); 2001, p109-112, 4p