Zobrazeno 1 - 10
of 19
pro vyhledávání: '"Igor Kostolny"'
Publikováno v:
Metals, Vol 11, Iss 4, p 624 (2021)
The aim of the research work was to characterize the soldering alloy type Bi-Ag-Ti and to study the direct soldering of silicon and copper. Bi11Ag1.5Ti solder has a broad melting interval. Its scope depends mainly on the content of silver and titaniu
Externí odkaz:
https://doaj.org/article/6cf7bbb732e04cfdbd918c9392a747cd
Publikováno v:
Metals, Vol 11, Iss 1, p 27 (2020)
The aim of the research was to characterize the soldering alloy type Zn–Al–Cu and study the fluxless ultrasonic soldering of the combination of aluminum alloy type Al7075 with copper substrate. The Zn–Al–Cu solder is of the close-to-eutectic
Externí odkaz:
https://doaj.org/article/c0547446047141899c0dc2ae10feefd7
Publikováno v:
Metals, Vol 10, Iss 3, p 343 (2020)
The aim of this research is to characterize the soldering alloy Zn6Al6Ag, and to study the ultrasonic soldering of an Al2O3/metal−ceramic composite (Al/Al2O3). Zn6Al6Ag solder presents a quasi-eutectic structure with a melting point around 425 °C.
Externí odkaz:
https://doaj.org/article/c6a633821acf4db98b3f6deab9354d75
Publikováno v:
Metals, Vol 10, Iss 2, p 160 (2020)
This research aims to develop the direct soldering of aluminum nitride (AlN) ceramics with a copper substrate using Zn−Al−Mg solder. The solder type, Zn5Al3Mg, has a close-to eutectic composition with a melting point of 359 °C. The microstructur
Externí odkaz:
https://doaj.org/article/e064a68dc3a046c195caa379db3c0cd6
Publikováno v:
International Journal of Engineering Trends and Technology. 69:46-51
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::48390827550be498fd1b53890a6c620b
https://doi.org/10.14445/22315381/ijett-v69i10p207
https://doi.org/10.14445/22315381/ijett-v69i10p207
Publikováno v:
Materials
Materials; Volume 14; Issue 21; Pages: 6369
Materials, Vol 14, Iss 6369, p 6369 (2021)
Materials; Volume 14; Issue 21; Pages: 6369
Materials, Vol 14, Iss 6369, p 6369 (2021)
The aim of this research was to characterize soldering alloys of the type Sn–Sb–Ti and to study the ultrasonic soldering of SiC ceramics with a metal–ceramic composite of the type Cu–SiC. The Sn5Sb3Ti solder exerts a thermal transformation of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::da3e2baf5431e1ebd74120bb0a61b8b7
http://europepmc.org/articles/PMC8585135
http://europepmc.org/articles/PMC8585135
Autor:
Roman Kolenak, Igor Kostolny, Jaromir Drapala, Jan Urminsky, Alexej Pluhar, Paulina Babincova, Daniel Drimal
Publikováno v:
Materials; Volume 15; Issue 15; Pages: 5301
The aim of this research was to study the wettability and solderability of SiC ceramics by the use of an active solder of the type Sn5Sb3Ti in a vacuum by electron beam heating. This solder exerts a narrow melting interval, and only one thermal effec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8c1ea01204c23d8239487193fd6cb1b8
https://doi.org/10.3390/ma15155301
https://doi.org/10.3390/ma15155301
Publikováno v:
Metals
Volume 11
Issue 4
Metals, Vol 11, Iss 624, p 624 (2021)
Volume 11
Issue 4
Metals, Vol 11, Iss 624, p 624 (2021)
The aim of the research work was to characterize the soldering alloy type Bi-Ag-Ti and to study the direct soldering of silicon and copper. Bi11Ag1.5Ti solder has a broad melting interval. Its scope depends mainly on the content of silver and titaniu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5c7322399e489d66cee037c383abc9ef
http://hdl.handle.net/10084/143144
http://hdl.handle.net/10084/143144
Publikováno v:
Metals
Volume 10
Issue 3
Metals, Vol 10, Iss 3, p 343 (2020)
Volume 10
Issue 3
Metals, Vol 10, Iss 3, p 343 (2020)
The aim of this research is to characterize the soldering alloy Zn6Al6Ag, and to study the ultrasonic soldering of an Al2O3/metal&ndash
ceramic composite (Al/Al2O3). Zn6Al6Ag solder presents a quasi-eutectic structure with a melting point around
ceramic composite (Al/Al2O3). Zn6Al6Ag solder presents a quasi-eutectic structure with a melting point around
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a0be6b0c1fce11cb3042903411abe90e
Publikováno v:
Metals, Vol 10, Iss 2, p 160 (2020)
Metals
Volume 10
Issue 2
Metals
Volume 10
Issue 2
This research aims to develop the direct soldering of aluminum nitride (AlN) ceramics with a copper substrate using Zn&ndash
Al&ndash
Mg solder. The solder type, Zn5Al3Mg, has a close-to eutectic composition with a melting point of 359 °
Al&ndash
Mg solder. The solder type, Zn5Al3Mg, has a close-to eutectic composition with a melting point of 359 °
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::507a8a04d25c96db4798a9e9c98f1489
https://www.mdpi.com/2075-4701/10/2/160
https://www.mdpi.com/2075-4701/10/2/160