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In integrated circuit designs, the conductive connections between different layers are known as vias or cuts. Such structures are critical for digital circuit manufacturing, as they represent a common defect location. A well-established DfM/DfR rule
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::461dfd32d5f40665942e69aca5657f53
http://hdl.handle.net/11583/2920412
http://hdl.handle.net/11583/2920412
