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Superhydrophobic Copper Surfaces with Anticorrosion Properties Fabricated by Solventless CVD Methods
Publikováno v:
ACS Applied Materials & Interfaces. 9:1057-1065
Due to continuous miniaturization and increasing number of electrical components in electronics, copper interconnections have become critical for the design of 3D integrated circuits. However, corrosion attack on the copper metal can affect the elect
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c78aef8560591d436b307e0669ddf531
https://doi.org/10.1021/acsami.6b12119
https://doi.org/10.1021/acsami.6b12119
