Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Ick-Kyung Sung"'
Publikováno v:
Polyhedron. 42:102-109
New tungsten complexes based on the tridentate ligand [O,N,O]-2-[(4-hydroxy-3-pentene-2-ylidene)amino]phenol (hpap) were synthesized by the direct ligation of the ligand to WOCl4, leading to the displacement of two chloride units from the metal cente
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::80d15890f50eef5dcd351319b8c950ee
https://doi.org/10.1016/j.poly.2012.05.008
https://doi.org/10.1016/j.poly.2012.05.008
Publikováno v:
European Polymer Journal. 46:1642-1648
The dual-curable adhesive used to attach thin film transistors (TFTs) to color filters in the construction process of liquid crystal display (LCD) panels requires fast curing by UV irradiation and strong bond strength after thermal-curing. In additio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ede1af5acec49f79a66797bc02c4348e
https://doi.org/10.1016/j.eurpolymj.2009.05.034
https://doi.org/10.1016/j.eurpolymj.2009.05.034
Publikováno v:
Polymer Journal. 30:181-185
Poly(styrene-b-butadiene-b-styrene) (SBS) was blended with a tackifier resin such as aliphatic resin, aromatic resin or hydrogenated dicyclopentadiene resin to form the model pressure sensitive adhesive (PSA), and the dynamic mechanical and morpholog
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3e26f1036ea125bb44c59e17ed211144
https://doi.org/10.1295/polymj.30.181
https://doi.org/10.1295/polymj.30.181
Autor:
CHOPDA, JALPA V.1, SANKHAVARA, DHARMESH B.1, PATEL, JIGNESH P.1, PARSANIA, P. H.1 phparsania22@gmail.com
Publikováno v:
Journal of Polymer Materials. Oct-Dec2019, Vol. 36 Issue 4, p391-399. 9p.
Publikováno v:
SID Symposium Digest of Technical Papers; Jun2013, Vol. 44 Issue 1, p1134-1136, 3p
Autor:
Hanna Dodiuk
Handbook of Thermoset Plastics, Fourth Edition provides complete coverage of the chemical processes, manufacturing techniques and design properties of each polymer, along with its applications. This new edition has been expanded to include the latest
