Zobrazeno 1 - 10
of 240
pro vyhledávání: '"Ic manufacturing"'
Autor:
Lamia Alam, Nasser Kehtarnavaz
Publikováno v:
Sensors, Vol 24, Iss 3, p 738 (2024)
This paper discusses the problem of recognizing defective epoxy drop images for the purpose of performing vision-based die attachment inspection in integrated circuit (IC) manufacturing based on deep neural networks. Two supervised and two unsupervis
Externí odkaz:
https://doaj.org/article/5d57f6ba4e0e4d82a98e7c655e80dff9
Autor:
Jerzy Ruzyllo
Publikováno v:
Journal of Telecommunications and Information Technology, Iss 2 (2023)
This paper gives a brief overview of the challenges wafer cleaning technology is facing in the light of advanced silicon technology moving in the direction of non-planar device structures and the need for modified cleans for semiconductors other than
Externí odkaz:
https://doaj.org/article/95d8a4eb81d8441ea1e1c17d75aee7aa
Autor:
Lamia Alam, Nasser Kehtarnavaz
Publikováno v:
IEEE Access, Vol 10, Pp 83826-83840 (2022)
Defect detection plays a vital role in the manufacturing process of integrated circuits (ICs). Die attachment and wire bonding are two steps of the manufacturing process that determine the power and signal transmission quality and dependability in an
Externí odkaz:
https://doaj.org/article/56e375aa57ab4f7fadef36f4d5ee2918
Akademický článek
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Akademický článek
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Publikováno v:
Supply Chain Management: An International Journal, 2016, Vol. 21, Issue 1, pp. 103-124.
Externí odkaz:
http://www.emeraldinsight.com/doi/10.1108/SCM-03-2014-0089
Publikováno v:
IEEE Design & Test. 38:119-126
Editor’s notes: This article proposes a robust calculation method for the identification of anomalies in IC manufacturing test data while eliminating the need of large storage of raw measurements. — Said Hamdioui, Delft University of Technology
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ea53d5e40fed16e2902b4a44dc8e8276
https://doi.org/10.1109/mdat.2020.3036591
https://doi.org/10.1109/mdat.2020.3036591
Autor:
Dipankar Roy
Publikováno v:
Advances in Chemical Mechanical Planarization (CMP) ISBN: 9780128217917
Mitigation of process-induced defects is a primary objective of the emerging CMP strategies for IC manufacturing. The protocols considered in this approach frequently rely on the slurry chemistry to achieve planarization, while the mechanical functio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9ee32fdb337b3a0ac7821f299faabd00
https://doi.org/10.1016/b978-0-12-821791-7.00009-5
https://doi.org/10.1016/b978-0-12-821791-7.00009-5
Autor:
Dong Chunhui, Mengjie He, He Maodong, Chang Xin, Cao Xiaokang, Feng Tao, Rui Shouzhen, Liu Ziyang, Nijing Pi
Publikováno v:
2021 IEEE 12th International Conference on Mechanical and Intelligent Manufacturing Technologies (ICMIMT).
Temperature fast change during a step or several steps is required by latest etching process in IC manufacturing. Two methods to reach this requirement was described, and several simulation devices are designed to test the capability. The temperature
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4dab8edd0f1b3ac0418065795c17fce2
https://doi.org/10.1109/icmimt52186.2021.9476143
https://doi.org/10.1109/icmimt52186.2021.9476143
Autor:
David Graves
Publikováno v:
Advanced Etch Technology and Process Integration for Nanopatterning X.
PPPL recently launched a new initiative in non-equilibrium plasma (NEP) science and technology with a focus on applications associated with key industries of the future (IotF), including semiconductor integrated circuit (IC) device manufacturing and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::68231d0fe0a7066b290a6a00f76b8531
https://doi.org/10.1117/12.2587120
https://doi.org/10.1117/12.2587120