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Akademický článek
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Autor:
Litho World
Publikováno v:
Journal of Microelectronic Manufacturing, Vol 3, Iss 1, Pp 1-8 (2020)
China's IC industry has been flourishing in recent years, huge market demand together with government investments are the major driving forces for this development. The status and development momentum of the Chinese IC industry also attracted wide in
Externí odkaz:
https://doaj.org/article/dd75a48b11f94872986a88192861a3da
Akademický článek
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Recent Progress of the Integrated Circuit Industry in China ― Overview of the Manufacturing Industry
Autor:
Litho World
Publikováno v:
Journal of Microelectronic Manufacturing, Vol 3, Iss 3 (2020)
China's IC industry has been flourishing in recent years, huge market demand together with government investments are the major driving forces for this development. The status and development momentum of the Chinese IC industry also attracted wide in
Externí odkaz:
https://doaj.org/article/b0a0791939bd49b6996d1c94feb1eac7
Autor:
Goodell, Jim
This introduction to the book provides a conceptual and historical overview of learning engineering. Although its formal definition is still evolving, learning engineering aims to optimize specific learning solutions--from the learning sciences to hu
Externí odkaz:
https://library.oapen.org/handle/20.500.12657/86251
Autor:
Dadaipally Pragathi, M. Usha Rani, Ch. Usha Kumari, T. Santosh Kumar, P. Sriram Kumar, Asisa Kumar Panigrahy, T. Padma
Publikováno v:
Materials Today: Proceedings. 33:4007-4011
Through-silicon-via (TSV) technology has emerged as the key technology to enable 3D IC integration. 3D integration is seen as the leading candidate, which can help in sustaining Moore’s Law to future IC technology nodes. It clearly set a benchmark
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d4364954d97937d9a9098381f4a67f6c
https://doi.org/10.1016/j.matpr.2020.06.380
https://doi.org/10.1016/j.matpr.2020.06.380
Autor:
Qian Cao
Publikováno v:
DSIT
Based on the patent retrieval and analysis platform of Dongfang Lingdong, the patent application trend, patent type, applicant type, technical field and regional distribution of China's integrated circuit industry from 2010 to 2020 are discussed by u
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cc3ab6ddfc904e95175564c7f54df5a3
https://doi.org/10.1145/3478905.3478956
https://doi.org/10.1145/3478905.3478956
Autor:
Nicky Lu
Publikováno v:
DRC
This paper presents Four perspectives on how the IC Industry based on Silicon technologies continues to grow and is creating a multi-decade Golden Age through synergistic inventions regarding optimizing Monolithic and Heterogeneous Integration (MHI)
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d71229ab311abd7594042f5ad66da559
https://doi.org/10.1109/drc52342.2021.9467170
https://doi.org/10.1109/drc52342.2021.9467170
Publikováno v:
International Journal of Electronics Letters. 8:83-96
Fast pace growth in the IC industry is facing the challenges of feature size reduction which in turn demands an alternative to current CMOS VLSI. Quantum-dot cellular automata are emerging as one o...
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c65b536af61b195436ab6286bd0a2b91
https://doi.org/10.1080/21681724.2019.1570551
https://doi.org/10.1080/21681724.2019.1570551
Autor:
Litho World
Publikováno v:
Journal of Microelectronic Manufacturing, Vol 3, Iss 1, Pp 1-8 (2020)
China's IC industry has been flourishing in recent years, huge market demand together with government investments are the major driving forces for this development. The status and development momentum of the Chinese IC industry also attracted wide in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c8cdde4dd81a94a45708c0559fff5198
https://doi.org/10.33079/jomm.20030106
https://doi.org/10.33079/jomm.20030106