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Autor:
José M. Sánchez, Barbara Miner, Tracey Scherban, Jose A. Maiz, B. Sun, José M. Martínez-Esnaola, Daniel Pantuso, Javier Gil-Sevillano, D. Gonzalez, Ibon Ocana, Jun He, G. Xu, M. Reyes Elizalde, Jon M. Molina
Publikováno v:
Scopus-Elsevier
A new testing technique for the characterization of the mechanical behavior of the interconnect structures of integrated circuit devices is introduced in this paper. Modified crosssectional nanoindentation (MCSN) is the result of extending cross-sect
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::03b9f3ef421998fd47f4dc636f2080cc
http://www.scopus.com/inward/record.url?eid=2-s2.0-84869842718&partnerID=MN8TOARS
http://www.scopus.com/inward/record.url?eid=2-s2.0-84869842718&partnerID=MN8TOARS
