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pro vyhledávání: '"Ian Harvey Arellano"'
Autor:
Ian Harvey Arellano
Publikováno v:
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b8b02231ce167b9b3d3cf5e58981bef7
https://doi.org/10.1109/eptc53413.2021.9663954
https://doi.org/10.1109/eptc53413.2021.9663954
Autor:
Ian Harvey Arellano
Publikováno v:
Materials Letters. 244:1-5
The polyamide-polyacrylate system is one of the most industrially applied substrate-adhesive systems in the microelectronics industry. The utilization of polyacrylate-based adhesives has grown significantly as interfacial material for mechanical supp
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3e93f455bc29a2a70b952e170771e925
https://doi.org/10.1016/j.matlet.2019.02.053
https://doi.org/10.1016/j.matlet.2019.02.053
Publikováno v:
Materials Letters. 191:206-209
Following the observation of the effect of laser deflash (originally intended to remove tape residues) on the integrity of the NiPdAu surface and its impact on solderability, differential scanning calorimetric (DSC) analyses were performed on Sn-coat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::751b411a1400013bf46d9ec2a4f37c68
https://doi.org/10.1016/j.matlet.2016.12.061
https://doi.org/10.1016/j.matlet.2016.12.061
Autor:
Ernesto Antilano, Ian Harvey Arellano
Publikováno v:
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).
The market drive towards visually detectable solder joints for high reliability applications calls for the implementation of robust wettable flank technologies, wherein copper terminations at the package edges exposed after package singulation are ma
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7253ca486af5a104b9f0c53535a73e42
https://doi.org/10.1109/eptc47984.2019.9026617
https://doi.org/10.1109/eptc47984.2019.9026617
Autor:
Edamae Academia, Ian Harvey Arellano
The adhesion layer integrity of a polyamide-polyacrylate system as a function of thermal and mechanical treatment are explored by looking into the interaction/de-intercalation. Thermal treatment induced the intercalation of silicone into the adhesive
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0954214bb6d3861d0a47371cc27b4eea
Autor:
Edamae Academia, Ian Harvey Arellano
The identification of the nature of surface contaminants is important in designing the corrective actions to prevent the recurrence. Herein, Fourier transform infrared (FTIR) spectroscopy and time-of-flight secondary ion mass spectroscopy (TOF-SIMS)
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::17b289af6015b2e021625e485fd6e9f2
Autor:
Famela Abayari, Ian Harvey Arellano
The identification of the nature of foreign materials (FM) provides direction on the determination of the source, and guidance on the mitigation or elimination of its occurrence. Herein, we identified the most probable composition of the FMs found on
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::58a28afaffe68279ef2116e7a5979502
Incorporating a wettable sidewall in quad flat no-lead devices is one the new requirement of automotive customers to improve its performance in board level application. An alternative solution is through leadframe design modification in conjunction w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::197c692c12cfbaf16afd736a3216848e
The creation of a robust wettable flank architecture in quad-flat no-leads (QFN) packages is satisfied by the step-cut configuration, where the exposed sidewall is plated with Sn. The step-cut singulation process induces Cu burrs, which can lead to s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7e30a5dcb4e7dd569464010d261251ca
Autor:
Ian Harvey Arellano
A semiconductor package containing multiple dies could be assembled using independent assembly flows where each flow involved attaching a die on a carrier or onto another die using a die attach material, and electrically connecting the die to the car
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::67e81887cd5ed2b7e31e8f7914f4e520