Temperature effect on antenna protection strategy for plasma-process induced charging damage

Autor: Sander M. Smits, Cora Salm, F.G. Kuper, A. Scarpa, Zhichun Wang

Publikováno v: 7th International symposium of Plasma Process-Induced Damage, 134-137
STARTPAGE=134;ENDPAGE=137;TITLE=7th International symposium of Plasma Process-Induced Damage

The leakage current of different drain-well diodes for plasma-charging protection has been simulated at high temperature. The simulation shows that the high ambient temperature, especially during plasma deposition process, enormously enhances the eff

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9ccf1901d93f02a09a028a8b0d00b419
https://doi.org/10.1109/ppid.2002.1042627