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Autor:
Miko Elwenspoek, Henk van Wolferen, Wietze Nijdam, Stein Kuiper, Gert J. Veldhuis, Cees J.M. van Rijn
Publikováno v:
Journal of micromechanics and microengineering, 9(2), 170-172. IOP Publishing Ltd.
A microsieve with a very uniform pore size of 260 nm and a pore to pore spacing of 510 nm has been fabricated using multiple exposure interference lithography and (silicon) micro-machining technology. The sieve consists of a 0.1 µm thick silicon nit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::815303296452fae98594137ec135a34b
http://eprints.eemcs.utwente.nl/secure2/13214/01/JMM_9_170.pdf
http://eprints.eemcs.utwente.nl/secure2/13214/01/JMM_9_170.pdf
