Zobrazeno 1 - 10
of 8 338
pro vyhledávání: '"INTERFACIAL bonding"'
Autor:
Du, Linpu1,2 (AUTHOR), Ji, Xuping3 (AUTHOR), Lu, Kaiwei1,2 (AUTHOR), Wang, Jingquan1,2 (AUTHOR) wangjingquan@seu.edu.cn
Publikováno v:
Advances in Structural Engineering. Jul2024, Vol. 27 Issue 10, p1635-1647. 13p.
Autor:
Huy-Cuong Nguyen1 nguyenhuycuong@utc.edu.vn, Thi-Thanh-Thuy Pham1 thuyptt1@utc.edu.vn
Publikováno v:
Latin American Journal of Solids & Structures. 2024, Vol. 21 Issue 6, p1-14. 14p.
Autor:
Huang, Jincan1 (AUTHOR), Hou, Wei1,2 (AUTHOR) houwei@hqu.edu.cn, Li, Zhiqiang3 (AUTHOR), Liu, Yang1,2 (AUTHOR), Zhang, Yixin1,2 (AUTHOR) zhangyixin@hqu.edu.cn
Publikováno v:
Advances in Structural Engineering. Jun2024, Vol. 27 Issue 8, p1415-1428. 14p.
Autor:
Deng, Xinghong1 (AUTHOR), Zhang, Guangyu1 (AUTHOR), Mo, Yi1 (AUTHOR), Huang, Zhiyuan1 (AUTHOR), Zhou, Dekai1 (AUTHOR), Qiao, Jing2 (AUTHOR) jingqiao@hit.edu.cn, Li, Longqiu1 (AUTHOR) longqiuli@hit.edu.cn
Publikováno v:
International Journal of Smart & Nano Materials. Jun2024, Vol. 15 Issue 2, p387-404. 18p.
Autor:
Qiao, Degao1,2 (AUTHOR), Yang, Ming1 (AUTHOR) yangming@iet.cn, Gao, Yin1 (AUTHOR), Hou, Jue2 (AUTHOR), Zhang, Xingli2 (AUTHOR) zhang-xingli@nefu.edu.cn, Zhang, Hang1 (AUTHOR) zhanghang@iet.cn
Publikováno v:
Journal of Applied Physics. 4/7/2024, Vol. 135 Issue 13, p1-10. 10p.
Autor:
Periasamy, Kailashbalan1 (AUTHOR) maryam.darouie@rmit.edu.au, Darouie, Maryam1 (AUTHOR), Das, Raj1 (AUTHOR), Khatibi, Akbar A.1 (AUTHOR) akbar.khatibi@rmit.edu.au
Publikováno v:
Molecules. Mar2024, Vol. 29 Issue 5, p928. 14p.
Autor:
Almasaeid, Hatem H.1 almasaeid.h@aabu.edu.jo, Salman, Donia G.2, Abendeh, Raed M.3, Allouzi, Rabab A.4, Rabayah, Hesham S.3
Publikováno v:
Cogent Engineering. 2024, Vol. 11 Issue 1, p1-14. 14p.
Autor:
Khuzwayo, Bonga1 bongak@dut.ac.za
Publikováno v:
Acta Structilia. 2024, Vol. 31 Issue 1, p222-240. 19p.
Autor:
Li, Zhenkun1 (AUTHOR) skyouko@outlook.com, Zhao, Zhili2 (AUTHOR) zhaozhili2015@hrbust.edu.cn, Liu, Jinliang1 (AUTHOR) 1057349622@qq.com, Ding, Xin1 (AUTHOR) 1342915076@qq.com
Publikováno v:
Soldering & Surface Mount Technology. 2024, Vol. 36 Issue 3, p145-153. 9p.
Autor:
Kim, Sungwon1 (AUTHOR) swkim@kiost.ac.kr, Yi, Jin-Hak1 (AUTHOR) yijh@kiost.ac.kr, Hong, Hyemin1 (AUTHOR) hyeminhong@kiost.ac.kr, Choi, Seoung Ik1 (AUTHOR) sichoi@kiost.ac.kr, Kim, Dongchan2 (AUTHOR) kdc0357@seoultech.ac.kr, Kim, Min Ook2 (AUTHOR) minookkim@seoultech.ac.kr
Publikováno v:
Polymers (20734360). Nov2023, Vol. 15 Issue 21, p4290. 18p.