Zobrazeno 1 - 10
of 10 436
pro vyhledávání: '"INTEGRATED circuit interconnections"'
Autor:
XU, Zhao-Pei1, WANG, Kang-Jia1 konka05@163.com
Publikováno v:
Thermal Science. 2023, Vol. 27 Issue 3B, p2391-2398. 8p.
Publikováno v:
International Journal of Technology & Design Education. Nov2022, Vol. 32 Issue 5, p2527-2551. 25p.
Autor:
Singh, Amoldeep1 (AUTHOR) abharee_phd17@thapar.edu, Sandha, Karmjit Singh1 (AUTHOR) kssandha@thapar.edu, Rai, Mayank Kumar1 (AUTHOR) mkrai@thapar.edu
Publikováno v:
Journal of Circuits, Systems & Computers. 5/15/2024, Vol. 33 Issue 7, p1-24. 24p.
Autor:
Chamba, M. S.1 marlon.chamba@celec.gob.ec, Vargas, W.1 walter.vargas@celec.gob.ec, Echeverría, D.2 decheverria@cenace.gob.ec, Riofrio, J.1 jonathan.riofrio@celec.gob.ec
Publikováno v:
Leonardo. Jul2022, Vol. 55 Issue 4, p13-21. 9p. 4 Diagrams, 3 Charts, 5 Graphs.
Autor:
Ray, Sourav1 sray@mcmaster.ca, Bergen, Mark E.2 mbergen@umn.edu, John, George3 johnx001@umn.edu
Publikováno v:
Journal of Marketing. Sep2016, Vol. 80 Issue 5, p76-59. 75p. 10 Diagrams, 34 Charts, 9 Graphs.
Publikováno v:
XDSL News. Jan2024, Vol. 28 Issue 1, p6-7. 2p.
Publikováno v:
Iraq Telecom. Jan2024, Vol. 22 Issue 1, p8-9. 2p.
Autor:
Bhatti, Gulafsha1 (AUTHOR) 202021005@daiict.ac.in, Pathade, Takshashila1 (AUTHOR) takshu.chunarkar@gmail.com, Agrawal, Yash1 (AUTHOR) mr.yashagrawal@gmail.com, Palaparthy, Vinay1 (AUTHOR) vinay_shrinivas@daiict.ac.in, Gohel, Bakul1 (AUTHOR) bakul_gohel@daiict.ac.in, Parekh, Rutu1 (AUTHOR) rutu_parekh@daiict.ac.in, Girish Kumar, Mekala2 (AUTHOR) giri.frds@gmail.com
Publikováno v:
IETE Journal of Research. Mar2024, Vol. 70 Issue 3, p2878-2893. 16p.
Autor:
Rogozhin, A. E.1 (AUTHOR) rogozhin@ftian.ru, Glaz, O. G.1,2 (AUTHOR) glaz@ftian.ru
Publikováno v:
Russian Microelectronics. Feb2024, Vol. 53 Issue 1, p91-103. 13p.
Publikováno v:
XDSL News. Nov2023, Vol. 27 Issue 11, p12-13. 2p.