Zobrazeno 1 - 10
of 42
pro vyhledávání: '"I.K. Hui"'
Publikováno v:
Managing Service Quality: An International Journal. 13:300-309
Globalization and the borderless marketplace have created an opportunity for companies to come together to work on projects that could otherwise not be completed through the efforts of one or two companies acting independently. The formation of virtu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e90af844cad9dab5ed524b868549016f
https://doi.org/10.1108/09604520310484716
https://doi.org/10.1108/09604520310484716
Publikováno v:
The TQM Magazine. 13:112-119
The increasing consciousness of environmental protection has fostered the development of environmental management systems (EMS). ISO 14001 is an international standard that provides guidance for the establishment and monitoring of EMS implementation.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::85975a5c4232a9cc8c10bd937bd03e29
https://doi.org/10.1108/09544780110366024
https://doi.org/10.1108/09544780110366024
Publikováno v:
Soldering & Surface Mount Technology. 12:23-31
In a properly wetted joining system, with tin/lead solder as the filler and copper as the base metals, a layer of intermetallic compounds is usually found at the interface of these two metals. This layer, mainly copper and tin, has profound effects o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5ddd77f75f1349ac642831cd54696216
https://doi.org/10.1108/09540910010312384
https://doi.org/10.1108/09540910010312384
Publikováno v:
Journal of Electronics Manufacturing. :155-161
Printed circuit boards (PCBs) are perhaps the most crucial components for electronic products and each product requires a proprietary circuit board. Because of today’s rapid introduction of new products, traditional manual methods of manufacturing
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7d5033067501c1001cf4701435d0ba12
https://doi.org/10.1142/s0960313196000159
https://doi.org/10.1142/s0960313196000159
Publikováno v:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B. 19:669-678
A novel and direct method to measure the stress-strain properties of surface mount solder joints is proposed in this paper. The specimen used in the experiments is a quad flat pack (QFP)-solder-printed circuit board (PCB) assembly and the fabrication
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f2d5339f78147942667bc366df84702d
https://doi.org/10.1109/96.533910
https://doi.org/10.1109/96.533910
Publikováno v:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B. 19:679-684
This paper describes the improved characteristics of defect-free solder joints fabricated through modified reflow soldering. The modified method only requires that the solder joints are split for a very short time during a conventional solder reflow.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5dcfa94055e4a025d657e2db352f510e
https://doi.org/10.1109/96.533911
https://doi.org/10.1109/96.533911
Publikováno v:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B. 18:715-719
A direct method to measure the fatigue life of surface mount solder joints is proposed. This approach makes use of a quad flat pack (QFP) solder-printed circuit board (PCB) assembly as a shear specimen. After the assembly and thermal stress screening
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f00f7998e142d1540bc4715ee1d6d570
https://doi.org/10.1109/96.475280
https://doi.org/10.1109/96.475280
Autor:
ChanPang Li, I.K. Hui
Publikováno v:
SPIE Proceedings.
Environmental work in industry is considered as a strategically important issue. This is mainly driven by the social concerns about environmental impacts on human health and ecological system. A number of methods for the evaluation of environmental i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1fcb57c74ca27819c101900f602934a2
https://doi.org/10.1117/12.417267
https://doi.org/10.1117/12.417267
Publikováno v:
Managing Service Quality; 2003, Vol. 13 Issue 4, p300, 10p
Publikováno v:
Scopus-Elsevier
This paper mainly describes pore formation characteristics in surface mount solder joints and its effect on joint strength. Two PCB boards with 14-lands on each board are used in shear strength test. Several solder pastes and reflow temperature profi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1d43958ea62da7043338cc97aaae9cb3
http://www.scopus.com/inward/record.url?eid=2-s2.0-0028055349&partnerID=MN8TOARS
http://www.scopus.com/inward/record.url?eid=2-s2.0-0028055349&partnerID=MN8TOARS
