Zobrazeno 1 - 10
of 39
pro vyhledávání: '"I.C. Ume"'
Autor:
Bryan Rogers, Kathy Derksen, I.C. Ume, Cherif Guirguis, Parimal B. Patel, Aaron Mebane, Vishnu V. B. Reddy, Kola Akinade, Robert Case
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 9:1219-1226
Unique two-beam laser ultrasonic inspection (LUI) probes were developed for the inspection of the quality of all types of chip packages. Microelectronic assembly houses demand reliable quality inspection tools that can identify all interconnect defec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0d84de031c5438f1916676a5aedb32c0
https://doi.org/10.1109/tcpmt.2019.2911073
https://doi.org/10.1109/tcpmt.2019.2911073
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 3:1310-1320
Solder joint voids are usually formed by the entrapped gas bubbles during the reflow process and are common in all surface mount applications. It is a controversial issue on the reliability of the solder joint; however, the consensus is that voiding
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::681fcf2fcce7f7b158bd3952fa2d72ab
https://doi.org/10.1109/tcpmt.2013.2262500
https://doi.org/10.1109/tcpmt.2013.2262500
Publikováno v:
IEEE Transactions on Advanced Packaging. 33:19-29
Microelectronics packaging technology has evolved from through-hole and bulk configuration to surface-mount and small-profile ones. In surface mount packaging, such as flip chips, chip scale packages, and ball grid arrays, chips/packages are attached
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b7272225286d83a5734eeef5b804289d
https://doi.org/10.1109/tadvp.2009.2034634
https://doi.org/10.1109/tadvp.2009.2034634
Publikováno v:
IEEE Transactions on Advanced Packaging. 32:729-739
Current techniques for nondestructive quality evaluation of solder bumps in electronic packages are either incapable of detecting solder bump cracks, or unsuitable for in-line inspection due to high cost and low throughput. As an alternative, a solde
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7b9ef40f9244442e5aaf96b86753aa65
https://doi.org/10.1109/tadvp.2009.2025889
https://doi.org/10.1109/tadvp.2009.2025889
Publikováno v:
IEEE Transactions on Advanced Packaging. 31:447-453
Out-of-plane displacement (warpage) has been a major reliability concern for board-level electronic packaging. Printed wiring board (PWB) and component warpage results from coefficient of thermal expansion (CTE) mismatch among the materials that make
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::685eace7a0f6c973713a57b4a9806f75
https://doi.org/10.1109/tadvp.2008.927855
https://doi.org/10.1109/tadvp.2008.927855
Publikováno v:
IEEE Transactions on Advanced Packaging. 31:118-126
Although flip chips have received wide acceptance as an integrated circuit package, significant manufacturing problems exist with the integrity of the connection between the package and the printed circuit board (PCB). Conventional X-ray, ultrasonic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1e463fc9535fd3d59fc49035892b520c
https://doi.org/10.1109/tadvp.2007.914947
https://doi.org/10.1109/tadvp.2007.914947
Autor:
I.C. Ume, R.E. Powell
Publikováno v:
IEEE Transactions on Electronics Packaging Manufacturing. 31:83-90
In this paper, a warpage measurement system to simulate forced convective reflow is discussed. A warpage measurement system that can simulate convective reflow enables the real-time monitoring of printed wiring boards (PWBs), PWB assemblies (PWBAs),
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::42023f4b39df0007931ca9134752f29c
https://doi.org/10.1109/tepm.2007.914220
https://doi.org/10.1109/tepm.2007.914220
Autor:
I.C. Ume, R.E. Powell
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 30:500-508
The shadow moire and projection moire techniques are widely used methods for measuring printed wiring board (PWB) and PWB assembly (PWBA) warpage. Both methods have high resolution, high accuracy and are suitable for use in an online environment. Whe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8167126e3e012f4c68a0b47dc8402134
https://doi.org/10.1109/tcapt.2007.900066
https://doi.org/10.1109/tcapt.2007.900066
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 29:13-19
The detection of cracks in solder joints has been a challenge for the current nondestructive inspection techniques. This paper investigates the capability of a laser ultrasound and vibrometer inspection system to detect thermal cycle induced cracks i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9ac31ea8d7e0232be670038c4358c4f5
https://doi.org/10.1109/tcapt.2005.848567
https://doi.org/10.1109/tcapt.2005.848567
Autor:
D.S. Erdahl, I.C. Ume
Publikováno v:
IEEE Transactions on Advanced Packaging. 29:178-185
The adoption of surface-mount technology has spurred a rapid decrease in the size of electronic packages. Advanced active component packages, such as flip-chips, chip scale packages (CSPs), and ball grid arrays (BGAs), are attached to a printed wirin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::000d6d0b5361a62e82ec8c2f04cf7580
https://doi.org/10.1109/tadvp.2005.850508
https://doi.org/10.1109/tadvp.2005.850508