Zobrazeno 1 - 10
of 86
pro vyhledávání: '"Hyunseop Lee"'
Publikováno v:
Lubricants, Vol 11, Iss 7, p 297 (2023)
Lithium tantalite (LiTaO3) is a representative multifunctional single-crystal material with electro-optical, acoustic, piezoelectric, pyroelectric, and nonlinear optical properties used as a substrate for surface acoustic wave (SAW) devices. To enhan
Externí odkaz:
https://doaj.org/article/f32b0b93100244eb88f0fa5feb9fd9c6
Autor:
Hyunseop Lee
Publikováno v:
Lubricants, Vol 11, Iss 5, p 229 (2023)
Silicon carbide (SiC) is widely used as a power semiconductor substrate material, even if it takes a large amount of processing time to secure an appropriate surface as a wafer for devices after chemical mechanical polishing (CMP). Therefore, studies
Externí odkaz:
https://doaj.org/article/e32c15ca23bb4f2791b1acdf112f1412
Autor:
Hyunseop Lee
Publikováno v:
Micromachines, Vol 14, Iss 2, p 272 (2023)
Recently, various efforts have been made to reduce the environmental burden caused by semiconductor manufacturing by improving the process efficiency. Chemical mechanical polishing (CMP), which is used to planarize thin films in semiconductor product
Externí odkaz:
https://doaj.org/article/70d34d99d93f4644b758ed62bb2c6991
Autor:
Seonghyun Park, Hyunseop Lee
Publikováno v:
Applied Sciences, Vol 11, Iss 16, p 7232 (2021)
Chemical–mechanical polishing (CMP) is a planarization process that utilizes chemical reactions and mechanical material removal using abrasive particles. With the increasing integration of semiconductor devices, the CMP process is gaining increasin
Externí odkaz:
https://doaj.org/article/5d3f92bbeea04e2cb4c9d28aa117cadd
Autor:
Jungyu Son, Hyunseop Lee
Publikováno v:
Applied Sciences, Vol 11, Iss 8, p 3521 (2021)
Chemical–mechanical polishing (CMP) is a process that planarizes semiconductor surfaces and is essential for the manufacture of highly integrated devices. In CMP, pad conditioning using a disk with diamond grit is adopted to maintain the surface ro
Externí odkaz:
https://doaj.org/article/3c0a83c6fd1849048c008a95c38c83e4
Autor:
Jungyu Son, Hyunseop Lee
Publikováno v:
Micromachines, Vol 11, Iss 9, p 843 (2020)
After the development of 3D printing, the post-processing of the 3D-printed materials has been continuously studied, and with the recent expansion of the application of 3D printing, interest in it is increasing. Among various surface-machining proces
Externí odkaz:
https://doaj.org/article/2a268248128646568638c36b664e3652
Autor:
Taekyoung Kim, Hyunseop Lee
Publikováno v:
Micromachines, Vol 11, Iss 7, p 705 (2020)
Fluidized bed machining (FBM) is used for the surface finishing or cleaning of complex 3D machine parts. FBM is a process of injecting air into a chamber to encourage particles into a fluid-like state. Subsequently, FBM involves rotating the specimen
Externí odkaz:
https://doaj.org/article/f7843213337a4fd99947c65e91da54a6
Publikováno v:
Journal of Advanced Mechanical Design, Systems, and Manufacturing, Vol 6, Iss 1, Pp 113-120 (2012)
A simplified model related to microtopography on CMP pad and prediction of real contact area between the pad and wafers is presented in this paper. The model has been developed on the basis of the analysis of the pad surface roughness and contact mec
Externí odkaz:
https://doaj.org/article/55a4b391f21045e5ac17b95dc2c64cfc
Autor:
Hyunseop Lee, Siwoong Jang
Publikováno v:
Journal of the Korea Institute of Information and Communication Engineering. 27:311-317
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b640fc193255de2ad4ab7e44f6c289d2
https://doi.org/10.6109/jkiice.2023.27.3.311
https://doi.org/10.6109/jkiice.2023.27.3.311
Publikováno v:
International Journal of Precision Engineering and Manufacturing-Green Technology
Chemical mechanical polishing (CMP) is an essential planarization process for semiconductor manufacturing. The application of CMP has been increasing in semiconductor fabrication for highly integrated devices. Recently, environmental burden caused by
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::48a5dda098fc8b88967e82d5291fa98a
http://europepmc.org/articles/PMC8617369
http://europepmc.org/articles/PMC8617369