Development of Reliability Verification System for Robust Package Design.

Autor: Dongkil Shin, Hyunggil Baek, Joonyoung Oh, Dongok Kwak, Kuyoung Kim, Younghee Song, Jeongyeol Kim

Publikováno v: 2007 International Conference on Thermal, Mechanical & Multi-Physics Simulation Experiments in Microelectronics & Micro-Systems. EuroSime 2007; 2007, p1-7, 7p