Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Hyung-soo Moon"'
Publikováno v:
IMAPSource Proceedings. 2022
Die-embedded (DE) packaging technologies in recent years have ventured into advanced packaging structures, such as fan-out wafer level packages (FOWLPs) or package-on-packages (PoPs). They offer higher density at lower costs, despite many challenges,
Publikováno v:
SID Symposium Digest of Technical Papers. 53:853-856