Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Hyung Gil Baik"'
Publikováno v:
Journal of Electronic Packaging. 123:101-104
The reduction of the warpage of LSI package is a critical issue to ensure good solder joint connection in surface mount. In this study, different combinations of finite element and calculating methods were used to investigate the best method for pred
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::da12553b324eea8e0361686bfc8097aa
https://doi.org/10.1115/1.1339820
https://doi.org/10.1115/1.1339820
Publikováno v:
2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).
CSP (Chip Size Package) is expected to be widely used in D-RDRAM (Direct Rambus DRAM) for its higher electrical performance as well as in PDA (Personal Digital Assistant) applications for its smaller size and lighter weight. Especially wafer level CS
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::097c523beeebcb9fbeeb0bb4a61ff88b
https://doi.org/10.1109/ectc.2000.853167
https://doi.org/10.1109/ectc.2000.853167
Publikováno v:
2000 Proceedings 50th Electronic Components & Technology Conference (Cat. No.00CH37070); 2000, p301-310, 10p