Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Hyun-Joon Cha"'
Autor:
Junekyun Park, Hyun-Goo Jeon, Sam-Young Kim, Man-Young Shin, Kyung-Il Ouh, Sang-Cheol Shin, Back-Sung Kim, Hyun-Joon Cha, Jongwoo Park, Yong-Bum Jo
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 30:731-744
In this paper, the effects of Al pad contamination, epoxy molding compound [biphenyl (BP) and ortho-cresol novolac (OCN)] and wire (Au and alloy) on the propensity for the interfacial degradation of wire bond in a quad flap package under high tempera
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0c8ff73e995162b26ee4139f58469a18
https://doi.org/10.1109/tcapt.2007.906318
https://doi.org/10.1109/tcapt.2007.906318
Autor:
Jongwoo Park1 jongwoo.s.park@samsung.com, Hyun-Joon Cha1, Back-Sung Kim1, Yong-Bum Jo1, June-Kyun Park1, Sam-Young Kim1, Sang-Cheol Shin1, Man-Young Shin1, Kyung-Il Ouh1, Hyungoo Jeon1
Publikováno v:
IEEE Transactions on Components & Packaging Technologies. Dec2007, Vol. 30 Issue 4, p731-744. 14p. 5 Black and White Photographs, 1 Diagram, 4 Charts, 9 Graphs.