Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Hyun Yul Park"'
Autor:
Soon Seok Kwon, Hee Chang Jang, Hyun Yul Park, Jin Young Kim, Hyoung Ryeun Kim, Tae Yong Noh, Gil Joo Song, Min Soo Kim, Youhwan Shin, Seoung-Kyo Yoo, Jeong Hoon Hong, Sung Min Hwang
Publikováno v:
Aerosol and Air Quality Research. 17:936-941
We analyzed defective bonding pad in various ways and determined the causes of defects that boosts oxidation of aluminium by fluoride residue on surface of pad with moisture. Additionally, we compared and evaluated methods to minimize pad defects in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::93c891d62e3a848e73de6fa7e6b447ab
https://doi.org/10.4209/aaqr.2016.10.0457
https://doi.org/10.4209/aaqr.2016.10.0457
Autor:
Jin Young Kim, Seoung-Kyo Yoo, Hee Chang Jang, Hyoung Ryeun Kim, Tae Yong Noh, Euiji Choi, Hyun Yul Park, Jeong Hoon Hong, Sung Min Hwang, Soo Jong Koo, Eungsun Lee, Gil Joo Song
Publikováno v:
Aerosol and Air Quality Research. 15:2175-2183
We have investigated the hindrance to the deposition growth of silicon nitride (SiN) passivation layer from the contamination by airborne molecules in the front opening unified pod (FOUP). In particular, an artificial contamination of FOUP by fluorid
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cf4c22cc0f7d851ce7242108a7c8aa59
https://doi.org/10.4209/aaqr.2014.10.0238
https://doi.org/10.4209/aaqr.2014.10.0238
Autor:
Seoung-Kyo Yoo, Soon Seok Kwon, Jeong Hoon Hong, Sung Min Hwang, Hyun Yul Park, Hee Chang Jang, Hyoung Ryeun Kim, Jin Young Kim, Tae Yong Noh, Gil Joo Song
Publikováno v:
2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
Abnormal bonding pads have often been formed through a series of wafer processing steps, which may cause a variety of failure modes in the efficient operation of the end products. In this work, the effect of fluorine-outgassing on its formation as a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::730bbe5c10e6e4f8a7e05c51d8c70e0e
https://doi.org/10.1109/asmc.2017.7969216
https://doi.org/10.1109/asmc.2017.7969216
Autor:
Sung Min Hwang, Jang-Seop Kim, Ki-Sang Lee, Ja-Young Kim, Hee-Bog Kang, Yong Shin, Hyun-Yul Park, Byeong-Sam Moon, Sanghyun Lee, Jeong-Hoon An
Publikováno v:
ECS Transactions. 50:319-326
System on Chip (SoC) and System in Package (SiP) technologies provide a path for continued improvement in performance, power, cost and size at the system level without relying upon conventional CMOS scaling alone. SiP technology is rapidly evolved fr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::983ca94f936aa651550a29b15c496f5d
https://doi.org/10.1149/05005.0319ecst
https://doi.org/10.1149/05005.0319ecst
Publikováno v:
SPIE Proceedings.
To countermeasure the haze problem on a reticle, we investigated the mask storage environment of wafer manufacturing Fab and mask manufacturing Fab. Through IC (Ion chromatography) and AIM system, we measured the outgas quantities of Fab environment,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1d9fd951204165831cb129d4be93a272
https://doi.org/10.1117/12.626243
https://doi.org/10.1117/12.626243