Zobrazeno 1 - 10
of 16
pro vyhledávání: '"Hyun S. Kum"'
Autor:
Jongho Ji, Jeong Yong Yang, Sangho Lee, Seokgi Kim, Min Jae Yeom, Gyuhyung Lee, Heechang Shin, Sang-Hoon Bae, Jong-Hyun Ahn, Sungkyu Kim, Jeehwan Kim, Geonwook Yoo, Hyun S. Kum
Publikováno v:
Communications Engineering, Vol 3, Iss 1, Pp 1-7 (2024)
Abstract Heterogeneous integration of dissimilar crystalline materials has recently attracted considerable attention due to its potential for high-performance multifunctional electronic and photonic devices. The conventional method for fabricating he
Externí odkaz:
https://doaj.org/article/cf3547738b2a4a989d8856bc549b8e72
Autor:
Jongho Ji, Hoe-Min Kwak, Jimyeong Yu, Sangwoo Park, Jeong-Hwan Park, Hyunsoo Kim, Seokgi Kim, Sungkyu Kim, Dong-Seon Lee, Hyun S. Kum
Publikováno v:
Nano Convergence, Vol 10, Iss 1, Pp 1-21 (2023)
Abstract Remote epitaxy, which was discovered and reported in 2017, has seen a surge of interest in recent years. Although the technology seemed to be difficult to reproduce by other labs at first, remote epitaxy has come a long way and many groups a
Externí odkaz:
https://doaj.org/article/b33e53f004b848f98cedadfc56afb7b3
Autor:
Jongho Ji, Hoe-Min Kwak, Jimyeong Yu, Sangwoo Park, Jeong-Hwan Park, Hyunsoo Kim, Seokgi Kim, Sungkyu Kim, Dong-Seon Lee, Hyun S. Kum
Publikováno v:
Nano Convergence, Vol 10, Iss 1, Pp 1-2 (2023)
Externí odkaz:
https://doaj.org/article/6fcfe10798b1492f87cdef08f50a9fb2
Autor:
Zhang Xing, Afroja Akter, Hyun S. Kum, Yongmin Baek, Yong-Ho Ra, Geonwook Yoo, Kyusang Lee, Zetian Mi, Junseok Heo
Publikováno v:
Scientific Reports, Vol 12, Iss 1, Pp 1-7 (2022)
Abstract Intersubband (intraband) transitions allow absorption of photons in the infrared spectral regime, which is essential for IR-photodetector and optical communication applications. Among various technologies, nanodisks embedded in nanowires off
Externí odkaz:
https://doaj.org/article/7862186ceb30434ca56f7200744c113f
Autor:
Ki Seok Kim, Ji Eun Kang, Peng Chen, Sungkyu Kim, Jongho Ji, Geun Young Yeom, Jeehwan Kim, Hyun S. Kum
Publikováno v:
APL Materials, Vol 10, Iss 4, Pp 041105-041105-8 (2022)
Epitaxial lift-off techniques, which aim to separate ultrathin single-crystalline epitaxial layers off of the substrate, are becoming increasingly important due to the need of lightweight and flexible devices for heterogeneously integrated ultracompa
Externí odkaz:
https://doaj.org/article/f79ddcd92d274b2e90881c7bd603538f
Autor:
Jiho Shin, Hyunseok Kim, Suresh Sundaram, Junseok Jeong, Bo-In Park, Celesta S. Chang, Joonghoon Choi, Taemin Kim, Mayuran Saravanapavanantham, Kuangye Lu, Sungkyu Kim, Jun Min Suh, Ki Seok Kim, Min-Kyu Song, Yunpeng Liu, Kuan Qiao, Jae Hwan Kim, Yeongin Kim, Ji-Hoon Kang, Jekyung Kim, Doeon Lee, Jaeyong Lee, Justin S. Kim, Han Eol Lee, Hanwool Yeon, Hyun S. Kum, Sang-Hoon Bae, Vladimir Bulovic, Ki Jun Yu, Kyusang Lee, Kwanghun Chung, Young Joon Hong, Abdallah Ougazzaden, Jeehwan Kim
Publikováno v:
Nature. 614:81-87
Autor:
Ki Seok Kim, Doyoon Lee, Celesta S. Chang, Seunghwan Seo, Yaoqiao Hu, Soonyoung Cha, Hyunseok Kim, Jiho Shin, Ju-Hee Lee, Sangho Lee, Justin S. Kim, Ki Hyun Kim, Jun Min Suh, Yuan Meng, Bo-In Park, Jung-Hoon Lee, Hyung-Sang Park, Hyun S. Kum, Moon-Ho Jo, Geun Young Yeom, Kyeongjae Cho, Jin-Hong Park, Sang-Hoon Bae, Jeehwan Kim
Publikováno v:
Nature. 614:88-94
Publikováno v:
Science Bulletin.
Reconfigurable heterogeneous integration using stackable chips with embedded artificial intelligence
Autor:
Chanyeol Choi, Hyunseok Kim, Ji-Hoon Kang, Min-Kyu Song, Hanwool Yeon, Celesta S. Chang, Jun Min Suh, Jiho Shin, Kuangye Lu, Bo-In Park, Yeongin Kim, Han Eol Lee, Doyoon Lee, Jaeyong Lee, Ikbeom Jang, Subeen Pang, Kanghyun Ryu, Sang-Hoon Bae, Yifan Nie, Hyun S. Kum, Min-Chul Park, Suyoun Lee, Hyung-Jun Kim, Huaqiang Wu, Peng Lin, Jeehwan Kim
Publikováno v:
Nature Electronics. 5:386-393
Autor:
Yeongin Kim, Jun Min Suh, Jiho Shin, Yunpeng Liu, Hanwool Yeon, Kuan Qiao, Hyun S. Kum, Chansoo Kim, Han Eol Lee, Chanyeol Choi, Hyunseok Kim, Doyoon Lee, Jaeyong Lee, Ji-Hoon Kang, Bo-In Park, Sungsu Kang, Jihoon Kim, Sungkyu Kim, Joshua A. Perozek, Kejia Wang, Yongmo Park, Kumar Kishen, Lingping Kong, Tomás Palacios, Jungwon Park, Min-Chul Park, Hyung-jun Kim, Yun Seog Lee, Kyusang Lee, Sang-Hoon Bae, Wei Kong, Jiyeon Han, Jeehwan Kim
Publikováno v:
Science (New York, N.Y.). 377(6608)
Recent advances in flexible and stretchable electronics have led to a surge of electronic skin (e-skin)–based health monitoring platforms. Conventional wireless e-skins rely on rigid integrated circuit chips that compromise the overall flexibility