Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Hyun Pil Noh"'
Publikováno v:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 11:1675-1679
The electronic and geometric structures of C60 molecular layers on the Au(001) surface were studied by scanning tunneling microscopy (STM) and spectroscopy (STS) and ultraviolet photoemission spectroscopy (UPS). Due to the lattice mismatch between th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cf3598eda58b99fa20d7996b915562c3
https://doi.org/10.1116/1.578477
https://doi.org/10.1116/1.578477
Autor:
Jin-Ho Kim, Jongchol Shin, Kang-Bok Lee, Kwang-Ok Koh, Seok-Ha Lee, Jongwan Jung, Duck-Hyung Lee, Doo-Won Kwon, Kinam Kim, Chang-Rok Moon, Hyun-Pil Noh, D. Park, H.S. Jeong
Publikováno v:
2006 International Electron Devices Meeting.
Technology and characteristics of 8-mega density CMOS image sensor (CIS) with unit pixel size of 1.75times1.75mum2 are introduced. With recessed transfer gate (RTG) structure and other sophisticated process/device technology, remarkably enhanced satu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7daa2418a85f65d4932a93f9469ba773
https://doi.org/10.1109/iedm.2006.346975
https://doi.org/10.1109/iedm.2006.346975
Autor:
Kinam Kim, Hong-ki Kim, Duck-Hyung Lee, Jongwan Jung, Jae-Seob Roh, Jae-Hwang Sim, Doo-Won Kwon, Hyun-Pil Noh, Kang-Bok Lee, Chang-Rok Moon, Heegeun Jeongc, Kee-Hyun Paik, Seok-Ha Lee, D. Park
Publikováno v:
IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest..
5 mega CMOS image sensor with 1.9mum-pitch pixels has been implemented with 0.13 mum low power CMOS process. By applying 4-shared pixel architecture, 2.5V operation voltage, and tight design rules for some critical layers in pixels, high fill factor
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::963251ebd296a30c862f2928a1265861
https://doi.org/10.1109/iedm.2005.1609475
https://doi.org/10.1109/iedm.2005.1609475
Publikováno v:
SPIE Proceedings.
Benzo-Triazole (BTA) is considered as an important bridging material that can connect an organic polymer to the metal electrode on silicon wafers as a part of the microelectronics fabrication technology. We report a detailed process of surface induce
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d23010eadbbaa02ebe71f6e64bf16d82
https://doi.org/10.1117/12.657760
https://doi.org/10.1117/12.657760
Autor:
Young Woo Lee, Kang-Bok Lee, Chang Hyo Koo, Young Joon Cho, Duck-Hyung Lee, Jong Cheol Shin, Yeol Jon, Jong Rycol Yoo, Doo Cheol Park, Sung-Ho Hwang, Yum Ki Lee, Hyun Pil Noh, Suk Chul Bang, Kee-Hyun Paik, Kinam Kim, Jongwan Jung, Byung Jun Park, Young Sub Yoo, Dae-Woong Kim, Hee Geun Jung, Chang-Rok Moon
Publikováno v:
Extended Abstracts of the 2006 International Conference on Solid State Devices and Materials.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::83fd4f205e7eb57a4b8f411f2f63f76f
https://doi.org/10.7567/ssdm.2006.b-9-2
https://doi.org/10.7567/ssdm.2006.b-9-2
Autor:
Jeong-Ho Lyu, Hyun-woo Lee, Jongwan Jung, Youngsub You, Duck-Hyung Lee, Hwangyoon Klm, Hyun-Pil Noh, Je-Hyuck Song, Kinam Klm
Publikováno v:
Extended Abstracts of the 2005 International Conference on Solid State Devices and Materials.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d1eec5a087eb58e885021c95976a93de
https://doi.org/10.7567/ssdm.2005.e-5-2
https://doi.org/10.7567/ssdm.2005.e-5-2
Autor:
Hyun-Pil Noh, Young-Sam Jeon, Ki-Chang Song, Seung-Yoon Lee, Jung-Ho Kang, Don-Hee Lee, Taeho Lee, Jinho Ahn, Chil-Keun Park
Publikováno v:
Digest of Papers. Microprocesses and Nanotechnology'98. 198 International Microprocesses and Nanotechnology Conference (Cat. No.98EX135).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0e8cebe43c650fb744e5076e517e4757
https://doi.org/10.1109/imnc.1998.730001
https://doi.org/10.1109/imnc.1998.730001
Autor:
Ki-Chang Song, Don-Hee Lee, Young-Sam Jeon, Chil-Keun Park, Hyun-Pil Noh, Seung-Yoon Lee, Tae-Ho Lee, Jung-Ho Kang, Jinho Ahn
Publikováno v:
Digest of Papers Microprocesses & Nanotechnology'98 198 International Microprocesses & Nanotechnology Conference (Cat No98EX135); 1998, p117-118, 2p