Zobrazeno 1 - 10
of 15
pro vyhledávání: '"Hyun Jun Ahn"'
Autor:
Tae In Lee, Byung Jin Cho, Min Ju Kim, Hyun Jun Ahn, Rino Choi, Eui Joong Shin, Wan Sik Hwang, Hyun-Young Yu, Manh-Cuong Nguyen
Publikováno v:
IEEE Electron Device Letters. 40:1350-1353
We report on the impact of H2 high pressure annealing (H2-HPA) on a Y-doped ZrO2 (Y-ZrO2)/GeOx/Ge gate stack. In this paper, compared to conventional forming gas annealing (FGA), the H2-HPA increased the k-value of the Y-doped ZrO2 gate dielectric to
Autor:
Eui Joong Shin, Sung Won Shin, Seung Hwan Lee, Byung Jin Cho, Wan Sik Hwang, Hyun Jun Ahn, Hyun Yong Yu, Tae In Lee, Min Ju Kim
Publikováno v:
IEEE Electron Device Letters. 40:502-505
An advanced gate stack of Y-doped ZrO2 high-k dielectric is demonstrated for Ge MOSFETs. ZrO2 is implemented due to its high-permittivity (high-k) value, and additional Y is doped into the ZrO2 to enhance interfacial properties. The gate stack of ZrO
Publikováno v:
Microwave and Optical Technology Letters. 61:878-882
Publikováno v:
IEEE Transactions on Electron Devices. 66:378-382
The fluorine (F) effect originating from the chemical vapor deposited (CVD) tungsten (W) process on charge-trap flash memory devices was systematically investigated, and the CVD-W memory was compared with physical vapor deposited (PVD) W memory. The
Autor:
Tae In Lee, Eui Joong Shin, Byung Jin Cho, Jae Hwan Kim, Hyun Jun Ahn, Wan Sik Hwang, Seung Hwan Lee, Jae-Duk Lee, Sung Won Shin, Min Ju Kim
Publikováno v:
2020 IEEE International Electron Devices Meeting (IEDM).
We demonstrate for the first time that the use of an anti-ferroelectric film for the blocking layer of a charge trap flash (CTF) device significantly improves memory performance. The CTF device with the anti-ferroelectric blocking layer shows a large
Publikováno v:
JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE. 18:255-261
Autor:
Wan Sik Hwang, Hyun Yong Yu, Jungmin Moon, Tae In Lee, Byung Jin Cho, Yujin Seo, Hyun Jun Ahn
Publikováno v:
IEEE Transactions on Electron Devices. 64:4242-4245
A new method of forming an ohmic contact without an increase in parasitic resistance is proposed in the Ti/GeO2/Ge substrate. Fermi-level depinning in Ti/GeO2/n–Ge contacts is possible with the formation of an interfacial TiOx layer in the contacts
Autor:
Byung Jin Cho, Yujin Seo, Tae In Lee, Hyun Jun Ahn, Choong-Ki Kim, Jungmin Moon, Wan Sik Hwang, Hyun Yong Yu
Publikováno v:
IEEE Transactions on Electron Devices. 64:2599-2603
Nickel germanide (NiGe) was formed from atomic layer deposition (ALD) Ni on Ge and a subequent annealing process; the Ni film with low resistivity ( $34~\mu \Omega \cdot \text {cm}$ ) at 15 nm was obtained by N2 + H2 plasma treatment after Ni precurs
Autor:
Hyun Jun Ahn, Byung Jin Cho, Wan Sik Hwang, Yujin Seo, Hyun-Young Yu, Tae In Lee, Jungmin Moon
Publikováno v:
Solid-State Electronics. 130:57-62
The use of a GeO 2 interfacial layer (IL) between a high-k dielectric and a Ge substrate helps to reduce the interface state density in Ge MOS devices. We report that the presence of the GeO 2 IL changes the effective work function (eWF) of the gate
Autor:
Il Cheol Rho, Byung Jin Cho, Wan Sik Hwang, Jungmin Moon, Yujin Seo, Hyun Jun Ahn, Choon Hwan Kim, Choong-Ki Kim, Sungho Koh
Publikováno v:
IEEE Transactions on Electron Devices. 63:2858-2863
Erbium carbide (ErC2) prepared by atomic layer deposition (ALD) is successfully demonstrated for the first time as a novel work function (WF) metal for nMOSFET applications. The prepared ErC2 shows a very low effective WF (eWF), as low as 3.9 eV on H