Výsledky vyhledávání - "Hyslop, D.C."

Conference

Modelling the reliability of high-density substrates and associated microelectronic components.

Autor: Albrecht, H.-J., Hyslop, D.C., Jendrny, J., Muller, W.H., Ng, K.M.W., Tan, K.H.

Publikováno v: Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456); 2000, p412-418, 7p

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Conference

Modelling the effect of geometrical scaling on micro-electronic packaging.

Autor: Hyslop, D.C., Muller, W.H., Ng, K.M.W., Tan, K.H., Albrecht, H.-J.

Publikováno v: International Symposium on Electronic Materials & Packaging (EMAP2000) (Cat. No.00EX458); 2000, p99-106, 8p

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