Zobrazeno 1 - 1
of 1
pro vyhledávání: '"Hyongyol Mun"'
Autor:
Eunji Kim, Hyongyol Mun, Yeong L. Park, Sung-Dong Cho, Woon-Seob Lee, Sin-Woo Kang, Ki-Soon Bae, Sangwook Ji, Ki-Young Yun, Jonghoon Cho, Jang-ho Kim
Publikováno v:
3DIC
Control of Cu extrusion and delamination due to CTE mismatch between Si and Cu is a big issue for high reliable TSV formation. In this paper we tried to find some methods to reduce Cu extrusion and to prevent TSV sidewall delamination. It is demonstr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ca24e1fcdcd7f437d61eac7ccf33ecde
https://doi.org/10.1109/3dic.2012.6262947
https://doi.org/10.1109/3dic.2012.6262947
