Zobrazeno 1 - 10
of 15
pro vyhledávání: '"Hyo Sang Kang"'
Autor:
Seong Kuk Lee, Joo-Hyung Lee, Hee Ae Lee, Sung Chul Yi, Hyo Sang Kang, Jae Hwa Park, Won Il Park, Seunghoon Lee
Publikováno v:
Electronic Materials Letters. 17:43-53
We investigated the effects of different thermal treatment conditions on the surface and internal residual strains of bulk GaN grown by hydride vapor phase epitaxy (HVPE). Thermal annealing was performed at 700–1000 °C for 1–5 h in nitrogen atmo
Autor:
Won Il Park, Hee Ae Lee, Sung Chul Yi, Jae Hwa Park, Seung Min Kang, Joo-Hyung Lee, Hyo Sang Kang
Publikováno v:
Korean Journal of Metals and Materials. 57:582-588
Chemical mechanical polishing (CMP) of bulk AlN was performed with colloidal silica slurry at pH 9 for different times. The result shows that colloidal silica slurry at pH 9, which has the relatively high surface charge of -50.7 mV is most stable, an
Publikováno v:
Journal of the Korean Crystal Growth and Crystal Technology. 26:159-163
Autor:
Han Woo Nam, Hyun Mi Kim, Jae Hwa Park, Ki Woong Nam, Kwang Bo Shim, Bong Geun Choi, Hyo Sang Kang, Jae Sang Choi
Publikováno v:
Journal of the Korean Crystal Growth and Crystal Technology. 26:28-34
Far-infrared radiation ceramic is an attractive material that provides thermal therapy by permeating the infrared rays into the deep inside of the human skin. Therefore, it is currently used for thermal therapy devices, thermal mat, heating equipment
Autor:
Sung Ki Park, Kwon Hong, Sung-Hyuk Cho, Hyo Sang Kang, Kihong Yang, Young Bang Lee, Ji Hye Han, Hyung-Hwan Kim, Sanghyon Kwak, Hyung-Soon Park
Publikováno v:
ECS Transactions. 45:251-256
In a manufacturing semiconductor device, silicon nitride (Si3N4) and silicon oxide (SiO2) materials are typically and widely used as dielectric materials. In general, phosphoric acid is used for etch of silicon nitride film. The etch rate of phosphor
Autor:
Woo Sik Yoo, Choon Hwan Kim, Kyoung Bong Rouh, Kitaek Kang, Hyo Sang Kang, Toshikazu Ishigaki, Yong Seok Eun, Takeshi Ueda
Publikováno v:
AIP Conference Proceedings.
Arsenic (As+) implanted p-type wafers for n+ junction were prepared and annealed in a resistively heated, single wafer rapid thermal furnace in N2. The wafers were non-destructively characterized by multi-wavelength Raman spectroscopy and multi-wavel
Autor:
Seon-Yong Cha, Jaechun Cha, IlSic Jang, Seung-Woo Jin, ByounGyu Kim, HyoYoung Kang, Hyo Sang Kang, Anbae Lee, DongGoo Choi
Publikováno v:
AIP Conference Proceedings.
To make high performance sub 20nm DRAM peripheral transistor, new process approach in the ion implantation is strongly required. Main hurdles to meet the peripheral transistor's electrical requirement are Contact Resistance, Short Channel Effect and
Autor:
Sunghyuk Cho, Young Bang Lee, Ji Hye Han, Hyung Soon Park, Hyung Hwan Kim, Kwon Hong, Sung Ki Park, Hyo Sang Kang
Publikováno v:
ECS Meeting Abstracts. :884-884
not Available.
Publikováno v:
ECS Meeting Abstracts. :952-952
not Available.
Autor:
Choon-Hwan Kim, Il-Cheol Rho, Soo-Hyun Kim, Il-Keoun Han, Hyo-Sang Kang, Seung-Wook Ryu, Hyeong-Joon Kim, Selvaraj, S. Lawrence, Egawa, Takashi
Publikováno v:
Journal of The Electrochemical Society; 22009, Vol. 156 Issue 9, pH690-H693, 4p, 4 Black and White Photographs, 3 Diagrams, 1 Chart, 10 Graphs