Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Hyo Cheon Kang"'
Autor:
Soo Bok Chin, Do Hyun Cho, Dongchul Ihm, Byoung-Ho Lee, Hyo Cheon Kang, Chang Lyong Song, Jum Bun Lee, Tae-Yong Lee
Publikováno v:
SPIE Proceedings.
The measurement of edge roughness has become a hot issue in the semiconductor industry. Especially the contact roughness is being more critical as design rule shrinks. Major vendors offer a variety of features to measure the edge roughness in their C
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7495b53c8f2240b119dc9596aeb9292f
https://doi.org/10.1117/12.597948
https://doi.org/10.1117/12.597948
Autor:
Hwan NamKoong, Hyo-cheon Kang, Byoung-Ho Lee, Soo Bok Chin, Chang Hun Yun, T. Ninomiya, Mari Nozoe, T. Tamori, Jun Bum Lee
Publikováno v:
2003 5th International Conference on ASIC. Proceedings (IEEE Cat. No.03TH8690).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c86f450de2fa3bec8bbec0e580d55f60
https://doi.org/10.1109/issm.2003.1243276
https://doi.org/10.1109/issm.2003.1243276
Autor:
Chang Hun Yun, Hyo-Cheon Kang, Jun Bum Lee, Hwan NamKoong, Byoung Ho Lee, Soo Bok Chin, Tamori, T., Ninomiya, T., Nozoe, M.
Publikováno v:
2003 5th International Conference on ASIC. Proceedings (IEEE Cat. No.03TH8690); 2003, p251-254, 4p