Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Hyman G. Robles"'
Publikováno v:
2012 IEEE 62nd Electronic Components and Technology Conference.
In this paper, the fundamental understanding of copper (Cu) wire bonding process, and its interaction with the die bond pad surface and structure will be examined, using both Finite Element Analysis (FEA) and experimental study. In the FEA, the Cu wi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dcf05c112f405bbcce0b0e033274fc0f
https://doi.org/10.1109/ectc.2012.6248976
https://doi.org/10.1109/ectc.2012.6248976
Autor:
Beleran, John D., Bo, Yang Yong, Robles, Hyman G., Milanes, Antonino, Yeo, Alfred, Chong, Chan Kai
Publikováno v:
2012 IEEE 62nd Electronic Components & Technology Conference; 1/ 1/2012, p1124-1129, 6p
Publikováno v:
2012 IEEE 62nd Electronic Components & Technology Conference; 1/ 1/2012, p1-24, 24p