Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Hyeon Jun Jung"'
Publikováno v:
Journal of the Korean Society for Precision Engineering. 38:187-193
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4108a01b224c660c8d455b2aeeda9bc1
https://doi.org/10.7736/jkspe.020.101
https://doi.org/10.7736/jkspe.020.101
Publikováno v:
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC).
This paper presents that built-in stress of copper, FRP and solder-resist (SR) layers is critical to predict an IC package substrate's warpage at room temperature. The built-in stresses are 78MPa on copper, 16MPa on FR4 and 9MPa on SR through simple
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d35055a0eba3694e08c594eaaf05e231
https://doi.org/10.1109/eptc50525.2020.9315057
https://doi.org/10.1109/eptc50525.2020.9315057