Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Hwankyu Kim"'
Autor:
Hwankyu Kim
Publikováno v:
Biblical Studies ISBN: 9780195393361
The term “mysticism” is a modern scholarly category, not an ancient concept. Although the etymology of the term “mysticism” (from the Greek word myeo [“to be initiated”]) has roots in Greek mystery cults, ancient people did not use the te
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7c09237102a3f73c9b1525e4dd536687
https://doi.org/10.1093/obo/9780195393361-0305
https://doi.org/10.1093/obo/9780195393361-0305
Autor:
MinJae Lee, Keun-Soo Kim, Hwankyu Kim, DaeByoung Kang, TaeKyeong Hwang, Juhoon Yoon, David Jon Hiner, Dong Wook Kim, Seokgeun Ahn
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
High throughput interconnection technology has been achieved using a multi-chip gang bonding process with an advanced chip on wafer (CoW) test vehicle (TV). The TV had 30 µm of fine-pitch copper pillar (CuP) and the bonding test was performed using
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c24317a371879b0755b352617f483977
https://doi.org/10.1109/ectc.2016.171
https://doi.org/10.1109/ectc.2016.171
Autor:
MinJae Lee, Riko Radojcic, KeunSoo Kim, Sam Gu, David Jon Hiner, Michael G. Kelly, Seokgeun Ahn, Hwankyu Kim, DaeByoung Kang, Dong Wook Kim, Ron Huemoeller
Publikováno v:
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
Advanced chip on wafer (CoW) assembly has emerged as a key assembly technology for enabling advanced silicon nodes and complex integration. Traditional assembly methods for chip attach have proven capable in this approach, but suffer in the area of f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::058f82acff2c0d5bf40f2ad8f4cbe4aa
https://doi.org/10.1109/ectc.2015.7159565
https://doi.org/10.1109/ectc.2015.7159565
Publikováno v:
Bulletin of the Korean Chemical Society. Feb2019, Vol. 40 Issue 2, p173-179. 7p.
Autor:
Hiner, David, Kim, Dong Wook, Ahn, SeokGeun, Kim, KeunSoo, Kim, HwanKyu, Lee, MinJae, Kang, DaeByoung, Kelly, Michael, Huemoeller, Ron, Radojcic, Riko, Gu, Sam
Publikováno v:
2015 IEEE 65th Electronic Components & Technology Conference (ECTC); 2015, p17-21, 5p
Publikováno v:
2015 IEEE 65th Electronic Components & Technology Conference (ECTC); 2015, p1-36, 36p