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Autor:
Moon Gi Cho, Eun-Chul Ahn, Jinho Choi, Yong-hwan Kwon, Hwan Sik Lim, Sun-Hee Park, Jae-Sik Chung
Publikováno v:
International Symposium on Microelectronics. 2012:000906-000911
In order to minimize the large plate growth of Ag3Sn intermetallic compounds (IMCs) adversely affecting the mechanical behavior and reducing the reliability of solder joints, the Ag content of less than 3wt% has been suggested in ball grid array (BGA
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::96afce98de71073d79f6fb19087af5af
https://doi.org/10.4071/isom-2012-wp42
https://doi.org/10.4071/isom-2012-wp42
