Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Husam Alissa"'
Autor:
Sreejith Kochupurackal Rajan, Bharath Ramakrishnan, Husam Alissa, Washington Kim, Christian Belady, Muhannad S Bakir
Publikováno v:
IEEE Access, Vol 10, Pp 59259-59269 (2022)
The stagnation of Dennard scaling along with the move towards heterogeneous 2.5D and 3D ICs is increasing the thermal design power (TDP) envelopes of general-purpose CPUs. With conventional cooling approaches such as air-cooling and cold plates, it i
Externí odkaz:
https://doaj.org/article/de8f10f5c0de4700aa5359b347744449
Autor:
Pulkit A. Misra, Ioannis Manousakis, Esha Choukse, Majid Jalili, Inigo Goiri, Ashish Raniwala, Brijesh Warrier, Husam Alissa, Bharath Ramakrishnan, Phillip Tuma, Christian Belady, Marcus Fontoura, Ricardo Bianchini
Publikováno v:
IEEE Micro. 42:10-17
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0250a7dc53469ca836fb1bb85c2f9eaf
https://doi.org/10.1109/mm.2022.3163107
https://doi.org/10.1109/mm.2022.3163107
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3b25ab5484a8750cb8e4859aa26470d9
https://doi.org/10.1109/eptc56328.2022.10013227
https://doi.org/10.1109/eptc56328.2022.10013227