Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Hungbok Choi"'
Autor:
Jae-Hyun Kang, Ya-Chieh Lai, Kee Sup Kim, Hungbok Choi, Wilbur Luo, Daehyun Jang, Junsu Jeon, Seung Weon Paek, Naya Ha, Philippe Hurat
Publikováno v:
Design for Manufacturability through Design-Process Integration VI.
As patterning for advanced processes becomes more challenging, designs must become more process-aware. The conventional approach of running lithography simulation on designs to detect process hotspots is prohibitive in terms of runtime for designers,
Autor:
Hungbok Choi, Shady Abdelwahed, Ahmed Mohy, Mohamed Imam, Seung Weon Paek, Naya Ha, Byung-Moo Kim, Joo-Hyun Park, Kee Sup Kim, Jae-Hyun Kang
Publikováno v:
Design for Manufacturability through Design-Process Integration VI.
As a result, low fidelity patterns due to process variations can be detected and eventually corrected by designers as early in the tape out flow as right after design rule checking (DRC); a step no longer capable to totally account for process constr
Autor:
KangDuck Lee, Daehyun Jang, Joong-Won Jeon, Woon-Hyuk Choi, Joo-Hyun Park, No-Young Chung, Ki-Su Kim, Kun Young Chung, Seung Weon Paek, Bong-Seok Kim, DongSup Song, Byung-Moo Kim, WooYoung Noh, Sang-Min Bae, HyunSeok Song, Kee Sup Kim, Dae-Wook Kim, Jae Hyun Kang, Hungbok Choi, Seong-Ho Park, Junsu Jeon, Kyu-Myung Choi, Young-Duck Kim, Sung-eun Yu, Jinwoo Lee, Naya Ha, Young-ki Hong
Publikováno v:
Design for Manufacturability through Design-Process Integration VI.
A set of design for manufacturing (DFM) techniques have been developed and applied to 45nm, 32nm and 28nm logic process technologies. A noble technology combined a number of potential confliction of DFM techniques into a comprehensive solution. These
Publikováno v:
2011 IEEE/ACM International Conference on Computer-Aided Design (ICCAD).
Autor:
Yong-Cheul Kim, Kyu-Myung Choi, Byoung-Hyun Lee, Byung-Su Kim, Jae-Rim Lee, Chul Rim, Hungbok Choi, Sun-Ik Heo
Publikováno v:
2008 International SoC Design Conference.
Due to the increased random variations in nanometer silicon process technology as well as voltage and temperature variations, it is very hard to guarantee performance characteristics with traditional corner-based timing analysis method. The variation