Zobrazeno 1 - 10
of 13
pro vyhledávání: '"Hung-Wen Chiou"'
Autor:
Hung-Wen Chiou, An-Jhih Su, Shu-Ching Yang, Cheng-Jer Yang, Hsiao-Ping Huang, Jyh-Cheng Jeng, Cheng-Ching Yu
Publikováno v:
IFAC Proceedings Volumes. 41:11949-11954
There are many possible factors in semiconductor manufacturing processes such as metrology tool bias, product type, or chamber that may induce disturbance to the process output. To account for all these types, a context-based model is often used. The
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c35aea26e5fb242843f6e5c7e7cfffdc
https://doi.org/10.3182/20080706-5-kr-1001.02022
https://doi.org/10.3182/20080706-5-kr-1001.02022
Autor:
Hung-Wen Chiou, E. Zafiriou
Publikováno v:
Proceedings of 1994 American Control Conference - ACC '94.
The robust stability analysis of constrained model predictive control (CMPC) for linear time invariant and open-loop stable processes is the main topic of this paper. For the CMPC algorithm, the feedback controller is a piecewise linear operator due
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e319e07ac07a1109ffa2cef6681db6b0
https://doi.org/10.1109/acc.1994.735089
https://doi.org/10.1109/acc.1994.735089
Publikováno v:
Proceedings. 7th International Conference on Solid-State and Integrated Circuits Technology, 2004..
An advanced in-line process control methodology has been developed and proposed in this paper for the more and more aggressive challenging DRAM deep trench etching technique. Deep trench capacitor is the key element of DRAM (Mandelman et al., 2003) a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b9fd0dcb90a474f8056f8b04c9d1d8af
https://doi.org/10.1109/icsict.2004.1435070
https://doi.org/10.1109/icsict.2004.1435070
Publikováno v:
Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247).
To effectively improve and control copper polish performance, a thermal impact study and a process diagnosis methodology were explored and proposed in this paper for 0.18 /spl mu/m technology and beyond. Micro and macro thermal impacts on polishing o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5f47534d96fd209f830455188768f07b
https://doi.org/10.1109/iitc.1999.787085
https://doi.org/10.1109/iitc.1999.787085
Autor:
Evanghelos Zafiriou, Hung-Wen Chiou
Publikováno v:
1993 American Control Conference.
The presence of constraints in the on-line optimization problem solved by Model Predictive Control algorithms results in a nonlinear control system, even if the plant and model dynamics are linear. This is the case both for physical constraints, like
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c3c98a948925bf61a978c697a63eac49
https://doi.org/10.23919/acc.1993.4792877
https://doi.org/10.23919/acc.1993.4792877
Autor:
Hung-Wen Chiou, Chin-Wen Lee
Publikováno v:
The Journal of the Acoustical Society of America. 116:1327
The present invention provides a method for signal vibration alert. The method of the present invention recognizes significant substantial swerves and corresponding substantial edge-to-edge differences by eliminating the adverse effect of noise among
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a063fdc75fd61c45661551f6e61dcd2d
https://doi.org/10.1121/1.1809921
https://doi.org/10.1121/1.1809921
Publikováno v:
Biotechnology and Bioengineering. 27:756-760
A method of on-line optimal control for fed-batch culture of bakers yeast production is proposed. The feed rate is taken as the control variable. The specific growth rate of the yeast is the output variable and is determined from the balance equation
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e57cde247c83bd96f212646c3865ecfe
https://doi.org/10.1002/bit.260270525
https://doi.org/10.1002/bit.260270525
Publikováno v:
Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat No99EX247); 1999, p83-85, 3p
Publikováno v:
Proceedings 7th International Conference on Solid-State & Integrated Circuits Technology, 2004; 2004, p567-567, 1p