Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Hung-Che Liu"'
Publikováno v:
Materials, Vol 15, Iss 3, p 937 (2022)
Copper-to-copper (Cu-to-Cu) direct bonding is a promising approach to replace traditional solder joints in three-dimensional integrated circuits (3D ICs) packaging. It has been commonly conducted at a temperature over 300 °C, which is detrimental to
Externí odkaz:
https://doaj.org/article/8efdb573f61047f2bdfd63998bd84211
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3f8b2349bd250225503b772db3f54eca
https://doi.org/10.1109/ectc51906.2022.00347
https://doi.org/10.1109/ectc51906.2022.00347
Publikováno v:
2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
Cu-Cu joints have potential in high performance electric product. Although the voids in the bonding interface was observed, there was no report on the size distribution and evolution of voids due to ripening. In this paper, the void size distribution
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::76fcaa20f232f338b617881dd64b1e7e
https://doi.org/10.1109/ltb-3d53950.2021.9598384
https://doi.org/10.1109/ltb-3d53950.2021.9598384
Autor:
Kang-Ping Lee, Dinh-Phuc Tran, Fu-Chian Chen, Wei-You Hsu, Yi-Quan Lin, Hung-Che Liu, Chih Chen
Publikováno v:
Materials Letters. 313:131775
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b91de0de16ec13e2253db09c2fbfd48f
https://doi.org/10.1016/j.matlet.2022.131775
https://doi.org/10.1016/j.matlet.2022.131775
Publikováno v:
Materials Characterization. 181:111459
Cu-to-Cu direct bonding technology has been adopted to achieve ultra-high- density interconnects for 3D IC integration. Although the voids in the bonding interface was observed, there was no report on the size distribution and evolution of voids due
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8db20939f83c33ff8505fddac6ab77fb
https://doi.org/10.1016/j.matchar.2021.111459
https://doi.org/10.1016/j.matchar.2021.111459
Autor:
Chuan-Yu Fang, Dinh-Phuc Tran, Hung-Che Liu, Jia-Juen Ong, Yi-Quan Lin, Wei-You Hsu, Chih Chen
Publikováno v:
Journal of The Electrochemical Society; Apr2022, Vol. 169 Issue 4, p365-370, 6p