Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Hung Jeng-Nan"'
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
5G and AI technologies are widely applied to highly connected world across cloud, network and edge applications. The compute and bandwidth of high performance computing (HPC) systems such as supercomputer, data center and high-end servers are constan
Autor:
Hsi-Ching Wang, C.H. Yu, Doug C. H. Yu, Hsieh Ching-Hua, Chuei-Tang Wang, Welling Chu, Tai-Hao Peng, C. C. Kuo, Wei-Heng Lin, Jeng-Shien Hsieh, Chung-Hao Tsai, Yi-Yang Lei, Kuo-Chung Yee, Liang-Ju Yen, Lawrence Chiang Sheu, Issac Huang, C. S. Liu, Hung Jeng-Nan
Publikováno v:
2015 IEEE International Electron Devices Meeting (IEDM).
High performance passive devices for millimeter wave (MMW) system, including inductor, ring resonator, power combiner, coupler, balun, transmission line, and antenna, are first realized using integrated fan-out (InFO) wafer level packaging technology
Autor:
Hung, Jeng-Nan, 洪政男
100
In light of the rapid advancement in IC/MEMS/NEMS technology, the reliability is an essential factor for a successful microdevice product. However, the reliable application of these devices often depends on the fatigue of their microstructur
In light of the rapid advancement in IC/MEMS/NEMS technology, the reliability is an essential factor for a successful microdevice product. However, the reliable application of these devices often depends on the fatigue of their microstructur
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/88312660424363932960
Autor:
Y.H. Huang, W. C. Chiou, Yi-Chun Shih, T. Y. Wang, W.J. Wu, Y.C. Lin, C.H. Chang, F.W. Tsai, C. H. Tung, S.P. Jeng, Kuo-Nan Yang, Doug C. H. Yu, M. F. Chen, Pang-Yen Tsai, Jing-Cheng Lin, E.B. Liao, Shang-Yun Hou, Hun-Hsien Chang, Y.L. Lin, T.J. Wu, Hung Jeng-Nan, C.L. Yu
Publikováno v:
2010 International Electron Devices Meeting.
Technology challenges and solutions in the development and fabrication of high-density three dimensional (3D) chip integration structures have been investigated. Critical 3D integrated circuit (IC) enabling technologies, such as through silicon via (
Akademický článek
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Akademický článek
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Autor:
Tsai, Chung-Hao, Hsieh, Jeng-Shien, Lin, Wei-Heng, Yen, Liang-Ju, Hung, Jeng-Nan, Peng, Tai-Hao, Wang, Hsi-Ching, Kuo, Cheng-Yu, Huang, Issac, Chu, Welling, Lei, Yi-Yang, Yu, C. H., Sheu, Lawrence C., Hsieh, Ching-Hua, Liu, C. S., Yee, Kuo-Chung, Wang, Chuei-Tang, Yu, Doug
Publikováno v:
2015 IEEE International Electron Devices Meeting (IEDM); 1/1/2015, p1.4-25.2.4, 0p
Publikováno v:
Japanese Journal of Applied Physics; Jun2011, Vol. 50 Issue 6S, p1-1, 1p