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Challenges of small form factor 0402 and 0201 die side capacitor assembly process on high density interconnect flip chip substrate

Autor: Chin-Thong Cheong, A.N.R. Wagiman, C.C. Loke, Hun-Song Goh

Publikováno v: 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

This paper summarizes all the challenges in enabling the low cost high volume manufacturing (HVM) process to attach "ultra mini" 0201/0402 die side capacitors (DSC) onto a small form factor high density interconnect (HDI) flip chip substrate. The key

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::d868b917a7ab369b573b5d793307ee35
https://doi.org/10.1109/ectc.2004.1319362

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Challenges of small form factor 0402 and 0201 die side capacitor assembly process on high density interconnect flip chip substrate.

Autor: Loke, C.C., Chin-Thong Cheong, Hun-Song Goh, Wagiman, A.N.R.

Publikováno v: 2004 Proceedings 54th Electronic Components & Technology Conference (IEEE Cat. No.04CH37546); 2004, p342-342, 1p

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