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Akademický článek

Automated, IMU-based spine angle estimation and IMU location identification for telerehabilitation

Autor: Huiming Pan, Hong Wang, Dongxuan Li, Kezhe Zhu, Yuxiang Gao, Ruiqing Yin, Peter B. Shull

Publikováno v: Journal of NeuroEngineering and Rehabilitation, Vol 21, Iss 1, Pp 1-15 (2024)

Abstract Background Telerehabilitation is a promising avenue for improving patient outcomes and expanding accessibility. However, there is currently no spine-related assessment for telerehabilitation that covers multiple exercises. Methods We propose

Externí odkaz: https://doaj.org/article/0148c1fc1d3740ef9e7acbba27d8133a

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Theoretical and Experimental Study on Multiparameter Criteria of Ultrasonic Method for Foundation Piles

Autor: Peng Huang, Zequan Yu, Huiming Pan

Publikováno v: Lecture Notes in Civil Engineering ISBN: 9789819917471

As one of the important methods to survey the foundation pile integrity in most engineering industries in China, ultrasonic testing (UT) has such advantages as determining the position and scope of defects accurately and good operability. In this pap

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::00bb003edd5ad1a0b4a63209803422c3
https://doi.org/10.1007/978-981-99-1748-8_3

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Mechanical Performance and Reliability of a Sn–Ag–Cu–Sb Alloy at Elevated Temperatures

Autor: Lu Wenli, Jiaqi Ding, Guoyou Liu, Zhiwen Chen, Huiming Pan, Li Liu, Hui Li, Sheng Liu, N. C. Lee, Kun Ma, Jiasheng Yan, Meng Ruan

Publikováno v: IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:1081-1087

Solder interconnects are essential to the reliability of electronic devices. The addition of alloying elements was reported to provide beneficial effects to the microstructure and mechanical reliability of lead-free solder alloys. In this work, the e

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::e6485ce59dcf6dd9c5fc9ecf9289cb1a
https://doi.org/10.1109/tcpmt.2021.3093562

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Analysis on the Thermal Stress of Al-Si Thin Film using DIC Method

Autor: Zhiwen Chen, Chao Sun, Li Liu, Chongming Zhang, Guoliang Xu, Sheng Liu, Huiming Pan

Publikováno v: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT).

In electronics, silicon-based metal thin films are a sort of common material structure. In practical applications, electronic packaging materials should show stable mechanical properties under temperature changes, as well as predicted and preventing

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::2e467e02deffb139c767f9dafb8f5bec
https://doi.org/10.1109/icept52650.2021.9568201

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Design and optimization of a pneumatic DOD solder ball 3D printing system

Autor: Zhixian Min, Zhiwen Chen, Sheng Liu, Dinglei Zhao, Huiming Pan, Zhiqin Wang

Publikováno v: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT).

This work is to set up a solder 3D printing system for solder ball printing. Effect of major factors that may affect the performance of the system has also been investigated. Therefore, performance of the system was optimized. A pneumatic DOD (drop-o

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::d3f06cbf1ac209418bbdf38c08790376
https://doi.org/10.1109/icept52650.2021.9567989

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