Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Huib Scholten"'
Autor:
Xiao Hu, Henry Antony Martin, René Poelma, Jianlin Huang, Hans van Rijckevorsel, Huib Scholten, Edsger Smits, Willem D. van Driel, Guoqi Zhang
Publikováno v:
Materials & Design, Vol 244, Iss , Pp 113185- (2024)
Resin-reinforced Ag sintering materials represent a promising solution for die-attach applications in high-power devices requiring enhanced reliability and heat dissipation. However, the presence of resin and intricate microstructure poses challenges
Externí odkaz:
https://doaj.org/article/40315f8e9310416d93e7a72c0fe6dac7
Publikováno v:
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
In this paper, a modified Gurson model was developed to simulate the mechanical behavior of silver sintered materials in which the porosity is ranging from 5% to 40%. The effect of shear stress, void size, and porosity- and temperature-dependent elas
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2480bfa850001461500143a644a78892
https://doi.org/10.1109/eurosime.2018.8369959
https://doi.org/10.1109/eurosime.2018.8369959
Publikováno v:
Microelectronics Reliability. 51:1938-1942
In this paper, an investigation on the effect of high temperature aging on the thermomechanical properties, microstructure of the molding compounds and the reliability issues of the packages is presented. Experimental characterizations of aging effec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1c67752080c01bc14cefa99d6272d6d9
https://doi.org/10.1016/j.microrel.2011.07.075
https://doi.org/10.1016/j.microrel.2011.07.075
Publikováno v:
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.
To ensure high reliability for advanced automotive electronics, investigation and understanding on the failure mechanisms under harsh conditions are needed. New methods and technologies for improved reliability and increased lifetime should be develo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::45add9940c68aab18bfe42ce312f63c9
https://doi.org/10.1109/icept.2010.5582777
https://doi.org/10.1109/icept.2010.5582777
Publikováno v:
2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE).
In this paper, an investigation on the reliability issues of the packages for high temperature applications is presented. First, experimental characterizations of aging effect on the packaging materials and the package were carried out. DMA, TMA and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8707c1a10eb19315538fbdfcbcfce6d4
https://doi.org/10.1109/esime.2010.5464534
https://doi.org/10.1109/esime.2010.5464534