Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Hui Zhong Zeng"'
Publikováno v:
Journal of Sol-Gel Science and Technology. 82:627-634
The n-ZnO/p-NiO junctions have been fabricated by sol–gel method using Al as top electrodes and ITO as bottom electrodes for applications in resistive switching devices. Such devices exhibit homogenous and filamentary characteristics depending on t
Publikováno v:
RSC advances. 8(52)
We investigated the bipolar resistive switching (BRS) properties of Mn-doped NiO thin films by sol–gel spin-coating. As the Mn doping concentration increased, lattice constant, grain size and band gap were found to decrease simultaneously. Moreover
Publikováno v:
IOP Conference Series: Materials Science and Engineering. 490:022079
Publikováno v:
Nanoscale Research Letters
This paper reports an abnormal coexistence of different resistive switching behaviors including unipolar (URS), bipolar (BRS), and threshold switching (TRS) in an Al/NiO/indium tin oxide (ITO) structure fabricated by chemical solution deposition. The
Optimized growth and dielectric properties of barium titanate thin films on polycrystalline Ni foils
Autor:
Jiang Huang, Yuan Lin, Chonglin Chen, Wei Zheng Liang, Yan Da Ji, Hui Zhong Zeng, Tian Xiang Nan, Hui Du
Publikováno v:
Chinese Physics B. 21:067701
Barium titanate (BTO) thin films were deposited on polycrystalline Ni foils by using the polymer assisted deposition (PAD) technique. The growth conditions including ambient and annealing temperatures were carefully optimized based on thermal dynamic
Publikováno v:
Applied Physics Letters. 88:152901
Growth dynamics and unit cell migration of ferroelectric (Ba,Sr)TiO3 thin films were systematically studied with in situ reflective high-energy electron diffraction and atom force microscopy. By measuring the amplitudes of slow surface recovery oscil
Publikováno v:
Journal of Electroceramics; Nov2005, Vol. 15 Issue 2, p135-141, 7p
Publikováno v:
Applied Physics Letters; 4/10/2006, Vol. 88 Issue 15, p152901, 3p, 4 Graphs
Publikováno v:
IOP Conference Series: Materials Science & Engineering; Apr2019, Vol. 490 Issue 2, p1-1, 1p