Zobrazeno 1 - 10
of 11
pro vyhledávání: '"Hui Jin Um"'
Publikováno v:
Materials & Design, Vol 245, Iss , Pp 113265- (2024)
Warpage in semiconductor packages is a critical issue that affects their reliability and performance. This study aims to minimize the warpage of a bi-material dummy package by optimizing the post-mold curing (PMC) temperature profile. A warpage simul
Externí odkaz:
https://doaj.org/article/0a43cc6d2e52476cbc2a4a0b203e0d8d
Publikováno v:
Scientific Reports, Vol 11, Iss 1, Pp 1-11 (2021)
Abstract Toe joint is known as one of the critical factors in designing a prosthetic foot due to its nonlinear stiffness characteristic. This stiffness characteristic provides a general feeling of springiness in the toe-off and it also affects the an
Externí odkaz:
https://doaj.org/article/3db268981e7d4253aa3b2deea0f92201
Autor:
Woolim Hong, Namita Anil Kumar, Shawanee Patrick, Hui-Jin Um, Heon-Su Kim, Hak-Sung Kim, Pilwon Hur
Publikováno v:
IEEE Robotics and Automation Letters. 7:11228-11235
Publikováno v:
2021 18th International Conference on Ubiquitous Robots (UR).
The toe joint is one of the important design factors for prosthetic foot. The toe joint provides feeling of springiness in toe-off step and its stiffness affects the ankle kinematics in robotic prosthesis during gait cycle. Moreover, since human toe
Publikováno v:
2021 18th International Conference on Ubiquitous Robots (UR).
In designing prosthetic foot, the function that can absorb the shock during the heel strike should be considered for the user’s convenience and safety. For this, we designed a 3D printable prosthetic foot that absorbs energy by applying an auxetic
Publikováno v:
Scientific Reports
Scientific Reports, Vol 11, Iss 1, Pp 1-11 (2021)
Scientific Reports, Vol 11, Iss 1, Pp 1-11 (2021)
Toe joint is known as one of the critical factors in designing a prosthetic foot due to its nonlinear stiffness characteristic. This stiffness characteristic provides a general feeling of springiness in the toe-off and it also affects the ankle kinet
Publikováno v:
Composite Structures. 291:115590
Publikováno v:
Composites Part B: Engineering. 238:109892
Publikováno v:
Microelectronics Reliability. 121:114146
Polymers are highly affected by moisture and temperature in terms of reliability of packaging. Especially, interface delamination between dissimilar materials with polymer is one of the major issues to the structural integrity and reliability, which
Publikováno v:
Composites Science and Technology. 207:108745
Thermoplastic differs in crystallinity depending on the manufacturing conditions such as temperature and cooling rate, which affect the mechanical properties of the thermoplastic-based composites. In this work, the crystallinity of polyethylene terep