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pro vyhledávání: '"Hugues C Gagnon"'
Autor:
Edmund Blackshear, Benjamin V. Fasano, Brian W. Quinlan, Yoichi Miyazawa, Tomoyuki Yamada, Richard Alan Heath, Paul Fortier, Frederick H. Roy, Hugues C Gagnon, David J. Lewison, Itsuroh Shishido, Elaine Cyr Takashi Nakajima, Shidong Li
Publikováno v:
International Symposium on Microelectronics. 2014:000074-000080
Coreless flip chip laminate substrates have shown significant advantages over cored versions in terms of wireability due to the absence of large coarse pitch core vias and accompanying via lands. Resistance to widespread acceptance of coreless has be