Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Hugo Reynes"'
Publikováno v:
International Journal of Thermofluids, Vol 13, Iss , Pp 100129- (2022)
A thermosyphon loop, designed for the thermal management of a large Medium voltage power converter 5 MW overall, corresponding to a 2.4 kW thermal load per cooling unit) is presented. The device is mainly made of an evaporator, a condenser and a rese
Externí odkaz:
https://doaj.org/article/64fc53d4b1fd4dd0aed7656b68b0ad8b
Autor:
Cyril Buttay, Hugo Reynes
Publikováno v:
France, N° de brevet: WO2020109138A1. 2020
HAL
HAL
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::0fdb84180aaca6763a25d557145c4ba6
https://hal.archives-ouvertes.fr/hal-03193213
https://hal.archives-ouvertes.fr/hal-03193213
Autor:
Cyril Buttay, Hugo Reynes
Publikováno v:
International Forum on Wide Bandgap Semiconductors China (IFWS)
International Forum on Wide Bandgap Semiconductors China (IFWS), Oct 2018, Shenzhen, China
HAL
International Forum on Wide Bandgap Semiconductors China (IFWS), Oct 2018, Shenzhen, China
HAL
International audience
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::34a30782b5f585402ef023aeb40c5d1b
https://hal.archives-ouvertes.fr/hal-01895875
https://hal.archives-ouvertes.fr/hal-01895875
Publikováno v:
Proceedings of the 2017 IEEE 5th Workshop on Wide Bandgap Power Devices and Applications
WiPDA
WiPDA, Oct 2017, Albuquerque, United States. ⟨10.1109/WiPDA.2017.8170581⟩
WiPDA
WiPDA, Oct 2017, Albuquerque, United States. ⟨10.1109/WiPDA.2017.8170581⟩
International audience; —Wide bandgap semiconductors enable high voltage (10 kV and more) switches. As a consequence, new packaging solutions are required to prepare the ground for such devices. The metallized ceramic substrate is a well-known and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::40116a9dd4e5feecaf3c1bf8fa2c9810
https://hal.archives-ouvertes.fr/hal-01645029
https://hal.archives-ouvertes.fr/hal-01645029
Publikováno v:
12th european advanced technology workshop on micropackaging and thermal management (iMaps)
12th european advanced technology workshop on micropackaging and thermal management (iMaps), IMAPS, Feb 2017, La Rochelle, France
HAL
12th european advanced technology workshop on micropackaging and thermal management (iMaps), IMAPS, Feb 2017, La Rochelle, France
HAL
International audience; High Voltage Direct Current (HVDC) is a replacement of the existing Alternating Current (HVAC) solutions for the transport of electricity using underwater cables. An example is the connexion of off-shore wind turbines to the e
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::b433cfe39ec80d820235ed8eda7fdd86
https://hal.archives-ouvertes.fr/hal-01473614
https://hal.archives-ouvertes.fr/hal-01473614
Publikováno v:
HAL
Recent advances in wide band-gap semiconductors technologies enable an increase in the power density of converters. The advantages of silicon carbide (SiC) devices are well documented and packaging solutions for high voltage components (6.5-10 kV) ar
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::eb1ccf06f696943bbe48b6e5753b7958
https://hal.archives-ouvertes.fr/hal-03760089
https://hal.archives-ouvertes.fr/hal-03760089