Zobrazeno 1 - 10
of 20
pro vyhledávání: '"Huen Wong"'
Publikováno v:
Marketing at the Confluence between Entertainment and Analytics ISBN: 9783319473307
Based on the expectancy-disconfirmation theory, the linkage between disconfirmation and satisfaction has been discussed for decades. Customer engagement has emerged as significant research area due to its role in enhancing competitive corporate advan
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6c557b3408738a398cb3cadb6806fa3e
https://doi.org/10.1007/978-3-319-47331-4_99
https://doi.org/10.1007/978-3-319-47331-4_99
Publikováno v:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A. 19:5-11
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::80b66c4535c7c3d48e16200ffc566f0f
https://doi.org/10.1109/95.486555
https://doi.org/10.1109/95.486555
Autor:
A.M. Benzoni, Yiu-Man Wong, D.T. Moser, Mindaugas Fernand Dautartas, S.L. Broutin, Alexander Coucoulas, Yiu-Huen Wong
Publikováno v:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B. 19:554-561
We discuss the details of the design and performance of the optics proposed for a MCM-D based low-cost multimode optical data link. The optical system is completely self-aligned, taking advantage of flip-chip bonding, solder-bump self-alignment, mech
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::599d5cf6f3f04cf4bc8838143fc55f1c
https://doi.org/10.1109/96.533895
https://doi.org/10.1109/96.533895
Publikováno v:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B. 18:552-557
A completely self-aligned optical sub-assembly is described that meets the optical alignment tolerances needed for low-loss LED and PIN photodiode OSA's. Solder reflow aligns the optical device (LED or PIN photodiode) to a silicon "header," which is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a08be148435273c4ae67c614538d3b5a
https://doi.org/10.1109/96.404115
https://doi.org/10.1109/96.404115
Autor:
G. E. Blonder, Y.C. Chen, Yiu-Huen Wong, Mindaugas Fernand Dautartas, Bertrand Harold Johnson, Carl R Paola, E. Rice, A.M. Benzoni
Publikováno v:
Journal of Lightwave Technology. 10:1078-1085
A multimode 2*2 optical switch made from chemically micro-machined silicon piece parts is described. This switch uses microlenses, aligned to fibers by a silicon base, to expand the optical beam and relax alignment tolerances and a pivoting silicon m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4850d052140855f908256312a3fcfb43
https://doi.org/10.1109/50.156848
https://doi.org/10.1109/50.156848
Autor:
Yoram de Hazan, Amir Hanjani, Yiu Huen Wong, Debbie Fleming, Alex Paunescu, Joseph Shmulovich, Sergey Frolov, Gary Weber, Allan James Bruce
Publikováno v:
SPIE Proceedings.
Planar waveguide technology has long been touted as the major platform for optical integration, which could dramatically lower component/module size and cost in optical networks. This technology has finally come to maturity with such waveguide-based
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e20822a98306e785a24f48b29f6241a9
https://doi.org/10.1117/12.543535
https://doi.org/10.1117/12.543535
Publikováno v:
1997 Proceedings 47th Electronic Components and Technology Conference.
Miniaturization, low cost, and high performance are the trends in optical data link device packaging markets. Low cost, miniaturization, and high performance are achieved by reduction in the number of piece parts, process and assembly steps by popula
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::848408f61aa222f18a37da4b072b8e8d
https://doi.org/10.1109/ectc.1997.606331
https://doi.org/10.1109/ectc.1997.606331
Publikováno v:
1995 Proceedings. 45th Electronic Components and Technology Conference.
The use of anisotropically conductive adhesives (ACAs) for the direct interconnection of silicon chips to printed circuits offers numerous advantages including: reduced package thickness, improved environmental compatibility, lowered assembly tempera
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1525f837f482ec3caadf47cc80092e7d
https://doi.org/10.1109/ectc.1995.514369
https://doi.org/10.1109/ectc.1995.514369
Publikováno v:
IEEE Photonics Technology Letters. 5:1185-1187
We report the output saturation power, excess noise factor, and system performance of a highly concentrated Er/sup 3+/-doped planar optical waveguide amplifier. The performance data demonstrate the potential usefulness of planar optical waveguide amp
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cc5113bdc901cf369e948e008c701c87
https://doi.org/10.1109/68.248422
https://doi.org/10.1109/68.248422
Publikováno v:
IEEE Photonics Technology Letters. 5:1014-1016
We report on the concentration- and pump-dependent lifetimes of the spontaneous emission in Er/sup 3+/-doped fibers and Er/sup 3+/-doped waveguides. In addition, we measure the concentration dependence of the 550-nm fluorescence due to excited state
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::23d6e46d3bb26b705258c823e6944f87
https://doi.org/10.1109/68.257176
https://doi.org/10.1109/68.257176