Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Hubert Wihr"'
Autor:
Frank Riedel, Bastian Troger, Thomas Fries, Martin Schellenberger, Alexander Mühlig, Dirk Lewke, Stefan Bauer, Hubert Wihr
Publikováno v:
Key Engineering Materials. 613:87-93
Leading edge lithography processes require silicon wafers of nearly perfect flatness. In order to improve wafer manufacturing processes as well as the wafer quality, already early manufacturing processes like grinding and lapping have to be monitored
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0d0707f8c21c909b11cbe42883f11abb
https://doi.org/10.4028/www.scientific.net/kem.613.87
https://doi.org/10.4028/www.scientific.net/kem.613.87
Autor:
Frank Riedel, Martin Schellenberger, Bastian Troger, Thomas Fries, Dirk Lewke, Stefan Bauer, Alexander Muehlig, Hubert Wihr, Lothar Pfitzner
Feature sizes of transistors manufactured on silicon wafers in high volume reached 22 nm and will further decrease in the future. Superior wafer surface quality is mandatory to produce such small feature sizes. One relevant quality parameter is the n
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e064d0cd6c7b7f9c67b9341f57d1aa6e
